BERGQUIST SIL PAD TSP 1416 is a highly thermally conductive, electrically insulating silicone elastomeric material. It features excellent cut-through resistance, encapsulates small metal slivers and burrs, and has a non-stick surface for easy separation during rework. The material is reinforced with fiberglass for added durability and has a UL rating of V-1. It complies with RoHS standards and operates within a temperature range of -60 to 180ºC.
| Property | Test Method | Value |
|---|---|---|
| Physical Properties | ||
| Flammability Rating | UL 94 | V-1 |
| Electrical Properties | ||
| Dielectric Breakdown Voltage | ASTM D149 | 6,000 Vac |
| Dielectric Constant @ 1,000 Hz | ASTM D150 | 6.0 |
| Volume Resistivity | ASTM D257 | 1×10¹⁰ ohm-meter |
| Thermal Properties | ||
| Thermal Conductivity | ASTM D5470 | 1.6 W/(m-K) |
| Thermal Performance vs. Pressure | ||
| TO-220 Thermal Performance @ 10 psi | 4.6 ºC/W | |
| TO-220 Thermal Performance @ 25 psi | 4.37 ºC/W | |
| TO-220 Thermal Performance @ 50 psi | 4.07 ºC/W | |
| TO-220 Thermal Performance @ 100 psi | 3.8 ºC/W | |
| TO-220 Thermal Performance @ 200 psi | 3.45 ºC/W | |
| Thermal Impedance @ 10 psi | ASTM D5470 | 1.53 ºC-in²/W |
| Thermal Impedance @ 25 psi | ASTM D5470 | 1.23 ºC-in²/W |
| Thermal Impedance @ 50 psi | ASTM D5470 | 1.03 ºC-in²/W |
| Thermal Impedance @ 100 psi | ASTM D5470 | 0.87 ºC-in²/W |
| Thermal Impedance @ 200 psi | ASTM D5470 | 0.75 ºC-in²/W |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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