BERGQUIST SIL PAD TSP 1416 is a highly thermally conductive, electrically insulating silicone elastomeric material. It features excellent cut-through resistance, encapsulates small metal slivers and burrs, and has a non-stick surface for easy separation during rework. The material is reinforced with fiberglass for added durability and has a UL rating of V-1. It complies with RoHS standards and operates within a temperature range of -60 to 180ºC.
| Property | Test Method | Value |
|---|---|---|
| Physical Properties | ||
| Flammability Rating | UL 94 | V-1 |
| Electrical Properties | ||
| Dielectric Breakdown Voltage | ASTM D149 | 6,000 Vac |
| Dielectric Constant @ 1,000 Hz | ASTM D150 | 6.0 |
| Volume Resistivity | ASTM D257 | 1×10¹⁰ ohm-meter |
| Thermal Properties | ||
| Thermal Conductivity | ASTM D5470 | 1.6 W/(m-K) |
| Thermal Performance vs. Pressure | ||
| TO-220 Thermal Performance @ 10 psi | 4.6 ºC/W | |
| TO-220 Thermal Performance @ 25 psi | 4.37 ºC/W | |
| TO-220 Thermal Performance @ 50 psi | 4.07 ºC/W | |
| TO-220 Thermal Performance @ 100 psi | 3.8 ºC/W | |
| TO-220 Thermal Performance @ 200 psi | 3.45 ºC/W | |
| Thermal Impedance @ 10 psi | ASTM D5470 | 1.53 ºC-in²/W |
| Thermal Impedance @ 25 psi | ASTM D5470 | 1.23 ºC-in²/W |
| Thermal Impedance @ 50 psi | ASTM D5470 | 1.03 ºC-in²/W |
| Thermal Impedance @ 100 psi | ASTM D5470 | 0.87 ºC-in²/W |
| Thermal Impedance @ 200 psi | ASTM D5470 | 0.75 ºC-in²/W |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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