BERGQUIST SIL PAD TSP 1500 is an electrically insulating and thermally conductive elastomeric material reinforced with fiberglass. It is designed for high-reliability electronic packaging applications and features conformability, grease-free performance, and a wide operating temperature range of -60 to 200ºC.
| Property | Test Method | Value |
|---|---|---|
| Physical Properties | ||
| Hardness (Shore A) | ASTM D2240 | 80 |
| Breaking Strength (KN/m) | ASTM D1458 | 12 |
| Elongation (%) | ASTM D412 | 20 |
| Tensile Strength (MPa) | ASTM D412 | 7 |
| Flammability Rating | UL 94 | V-0 |
| Electrical Properties | ||
| Dielectric Breakdown Voltage (VAC) | ASTM D149 | 4,000 |
| Dielectric Constant @ 1,000 Hz | ASTM D150 | 4.0 |
| Volume Resistivity (ohm-meter) | ASTM D257 | 1×10¹¹ |
| Thermal Properties | ||
| Thermal Conductivity (W/m-K) | ASTM D5470 | 2.0 |
| Thermal Performance vs. Pressure | ||
| TO-220 Thermal Performance (ºC/W) @ 10 psi | 3.54 | |
| TO-220 Thermal Performance (ºC/W) @ 25 psi | 3.18 | |
| TO-220 Thermal Performance (ºC/W) @ 50 psi | 2.68 | |
| TO-220 Thermal Performance (ºC/W) @ 100 psi | 2.4 | |
| TO-220 Thermal Performance (ºC/W) @ 200 psi | 2.22 | |
| Thermal Impedance (ºC-in²/W) @ Different Pressures | ||
| 10 psi | ASTM D5470 | 0.72 |
| 25 psi | ASTM D5470 | 0.57 |
| 50 psi | ASTM D5470 | 0.46 |
| 100 psi | ASTM D5470 | 0.38 |
| 200 psi | ASTM D5470 | 0.32 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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