BERGQUIST SIL PAD TSP 1500 is an electrically insulating and thermally conductive elastomeric material reinforced with fiberglass. It is designed for high-reliability electronic packaging applications and features conformability, grease-free performance, and a wide operating temperature range of -60 to 200ºC.
| Property | Test Method | Value |
|---|---|---|
| Physical Properties | ||
| Hardness (Shore A) | ASTM D2240 | 80 |
| Breaking Strength (KN/m) | ASTM D1458 | 12 |
| Elongation (%) | ASTM D412 | 20 |
| Tensile Strength (MPa) | ASTM D412 | 7 |
| Flammability Rating | UL 94 | V-0 |
| Electrical Properties | ||
| Dielectric Breakdown Voltage (VAC) | ASTM D149 | 4,000 |
| Dielectric Constant @ 1,000 Hz | ASTM D150 | 4.0 |
| Volume Resistivity (ohm-meter) | ASTM D257 | 1×10¹¹ |
| Thermal Properties | ||
| Thermal Conductivity (W/m-K) | ASTM D5470 | 2.0 |
| Thermal Performance vs. Pressure | ||
| TO-220 Thermal Performance (ºC/W) @ 10 psi | 3.54 | |
| TO-220 Thermal Performance (ºC/W) @ 25 psi | 3.18 | |
| TO-220 Thermal Performance (ºC/W) @ 50 psi | 2.68 | |
| TO-220 Thermal Performance (ºC/W) @ 100 psi | 2.4 | |
| TO-220 Thermal Performance (ºC/W) @ 200 psi | 2.22 | |
| Thermal Impedance (ºC-in²/W) @ Different Pressures | ||
| 10 psi | ASTM D5470 | 0.72 |
| 25 psi | ASTM D5470 | 0.57 |
| 50 psi | ASTM D5470 | 0.46 |
| 100 psi | ASTM D5470 | 0.38 |
| 200 psi | ASTM D5470 | 0.32 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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