BERGQUIST SIL PAD TSP 1600, also known as BERGQUIST SIL-PAD 800, is a high-performance silicone-based thermal insulator with fiberglass reinforcement. It is designed for low-pressure applications, providing high thermal conductivity, smooth surface compliance, and electrical isolation.
| Property | Value | Test Method |
|---|---|---|
| Hardness | 91 Shore A | ASTM D2240 |
| Elongation | 20% | ASTM D412 |
| Tensile Strength | 12 MPa | ASTM D412 |
| Flammability Rating | V-0 | UL 94 |
| Property | Value | Test Method |
|---|---|---|
| Dielectric Breakdown Voltage | 3,000 Vac | ASTM D149 |
| Dielectric Constant (@1,000 Hz) | 6.0 | ASTM D150 |
| Volume Resistivity | 1×10¹⁰ ohm-meter | ASTM D257 |
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 1.6 W/(m-K) | ASTM D5470 |
| Pressure (psi) | TO-220 Thermal Performance (°C/W) | Thermal Impedance (°C-in²/W) |
|---|---|---|
| 10 | 3.56 | 0.92 |
| 25 | 3.01 | 0.60 |
| 50 | 2.45 | 0.45 |
| 100 | 2.05 | 0.36 |
| 200 | 1.74 | 0.29 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.