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BERGQUIST SIL PAD TSP 3500 – Electrically Insulating, Thermally Conductive Pad – High-Performance Electronics Cooling

  • Item Name: BERGQUIST SIL PAD TSP 3500 (Known as BERGQUIST SIL-PAD 2000)
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Insulator
  • Technologies: Silicone, Fiberglass-Reinforced Thermal Interface Material
  • Applications: Thermal management in power supplies, motor controls, power semiconductors, aerospace, and avionics.
  • Color: White
  • Cure Type: Not applicable (pre-cured thermal pad)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

BERGQUIST SIL PAD TSP 3500

(Also known as BERGQUIST SIL-PAD 2000)

1. Product Overview

BERGQUIST SIL PAD TSP 3500 is a high-performance, thermally conductive insulator designed for demanding aerospace and commercial applications. It is a grease-free, conformable material that enhances thermal and dielectric performance.

  • Technology: Silicone
  • Appearance: White
  • Reinforcement Carrier: Fiberglass
  • Total Thickness: 0.254 to 0.508mm (ASTM D374)
  • Operating Temperature Range: -60 to 200°C
  • Thermal Conductivity: 3.5 W/m-K
  • Flammability Rating: UL 94 V-0

2. Applications

  • Power supplies
  • Motor controls
  • Power semiconductors
  • Aerospace & avionics

3. Typical Properties

Category Property Test Method Value
Physical Properties Hardness, Shore A ASTM D2240 90
Electrical Properties Dielectric Breakdown Voltage ASTM D149 4,000 Vac
Dielectric Constant @ 1,000 Hz ASTM D150 4.0
Volume Resistivity ASTM D257 1×10¹¹ ohm-meter
Thermal Properties Thermal Conductivity ASTM D5470 3.5 W/m-K
Thermal Performance vs. Pressure (TO-220 at 0.01″) @ 10 psi 2.61°C/W
@ 25 psi 2.32°C/W
@ 50 psi 2.02°C/W
@ 100 psi 1.65°C/W
@ 200 psi 1.37°C/W
Thermal Impedance (at 0.01″) @ 10 psi 0.57°C-in²/W
@ 25 psi 0.43°C-in²/W
@ 50 psi 0.33°C-in²/W
@ 100 psi 0.25°C-in²/W
@ 200 psi 0.2°C-in²/W

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