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BERGQUIST SIL PAD TSP Q2000 – Electrically Insulating, Thermally Conductive Pad – Electronics and Power Module Cooling

  • Item Name: BERGQUIST SIL PAD TSP Q2000 (BERGQUIST Q-PAD 3)
  • Manufacturer: Henkel
  • Product Category: Thermal Interface Material (TIM)
  • Technologies: Glass-reinforced grease replacement, silicone-based thermal pad
  • Applications: Used between heat-generating components and heat sinks, chassis, or power modules for thermal management
  • Color: Black
  • Cure Type: Pre-cured (no additional curing required)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

BERGQUIST SIL PAD TSP Q2000 is a glass-reinforced, silicone-based thermal interface material designed as a grease replacement. It provides a reliable thermal solution by eliminating contamination risks associated with thermal grease. The elastomer conforms to surface textures, minimizing air gaps and enhancing thermal performance. Fiberglass reinforcement ensures durability and ease of handling.

Key Features & Benefits:

  • Thermal impedance: 0.35°C-in²/W @ 50 psi
  • Eliminates processing challenges related to thermal grease
  • Conforms to surface textures for better thermal transfer
  • Easy handling and processing
  • Can be installed before soldering and cleaning

2. Applications

  • Between a transistor and a heat sink
  • Between large surfaces (e.g., L-bracket and chassis)
  • Between a heat sink and a chassis
  • Under electrically isolated power modules or devices (e.g., resistors, transformers, solid-state relays)

3. Typical Properties

Physical Properties

Property Value Test Standard
Hardness (Shore A) 86 ASTM D2240
Flammability Rating V-0 UL 94

Electrical Properties

Property Value Test Standard
Dielectric Breakdown Voltage Non-Insulating ASTM D149
Dielectric Constant (@1,000 Hz) N/A ASTM D150
Volume Resistivity 1×10² ohm-meter ASTM D257

Thermal Properties

Property Value Test Standard
Thermal Conductivity 2.0 W/(m-K) ASTM D5470

Thermal Performance vs. Pressure

Pressure (psi) TO-220 Thermal Performance (°C/W) Thermal Impedance (°C-in²/W)
10 psi 2.26 0.65
25 psi 1.99 0.48
50 psi 1.76 0.35
100 psi 1.53 0.24
200 psi 1.3 0.16

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