Industries

BERGQUIST TGR 4000 – Thermally Conductive Rubber Gap Filler – Electronics and Power Module Thermal Management

– Item Name: BERGQUIST TGR 4000 (Known as BERGQUIST TIC 4000)
– Manufacturer: Henkel
– Product Category: Thermal Interface Material (TIM), Thermally Conductive Grease
– Technologies: Silicone-based, Thermally Conductive Grease
– Applications: High-performance computer processors, high watt density applications requiring low thermal resistance
– Color: Gray
– Cure Type: No cure required, applies as a grease
– Package Size: Contact Techniq VN for details.
– Shelf Life: Contact Techniq VN for details.

1. Product Overview

BERGQUIST® TGR 4000 is a high-performance thermal interface compound designed for use as a thermal management solution between copper-based heat sinks and heat-generating components such as computer processors. It has a thermal conductivity of 4.0 W/m-K and provides excellent thermal performance with low thermal resistance. This thermally conductive compound is designed for high watt-density applications, ensuring efficient heat dissipation.

2. Applications

  • High-performance computer processors
  • High watt-density applications that require the lowest possible thermal resistance
  • Thermal interface material in electronic devices with copper-based heat sinks

3. Typical Properties

Physical Properties
Property Value Test Method
Density 4.0 g/cc ASTM D792
Electrical Properties
Property Value Test Method
Electrical Resistivity N/A (electrically non-conductive resin with conductive filler) ASTM D257
Thermal Properties
Property Value Test Method
Thermal Conductivity 4.0 W/m·K ASTM D5470
Thermal Performance vs. Pressure
Pressure (psi) Thermal Resistance (ºC/W)
10 psi 0.21
25 psi 0.20
50 psi 0.19
100 psi 0.19
200 psi 0.18

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