Item Numbers: BETA 600 (horizontal injection, single-station, integrated 7L melt tank, 3L optional)
Manufacturer: LPMS USA
Application: PCB and electronics encapsulation, waterproofing, strain relief, vibration and chemical protection
Dispensing Control: Integrated melt tank, 2 zones, Omron PLC, 7.5” touchscreen
Size & Weight: 1050 × 780 × 1700 mm, 683 lbs
Power & Certification: 220 VAC, 1 Phase, 25A, air 90–110 PSI, 4 CFM, safety: light curtains, E-stop, interlocks, LOTO
More information & technologies: Contact to Techniq VN for details. (Email: info@techniq.vn & Tel: +84 88 990 19 29)
The BETA 600 Low Pressure Molding Machine is an entry-level horizontal injection system equipped with an integrated melt tank. Compact yet robust, it is engineered for efficient encapsulation of sensitive electronic components using sustainable hot-melt adhesives. With Omron PLC controls, dual thermal zones, and a 7.5” touchscreen interface, it offers precise temperature management and simplified operation. Enhanced operator safety is ensured through light curtains, emergency stop systems, and interlocks, making the BETA 600 a reliable and flexible solution for both prototyping and volume production.
The machine is highly effective for circuit board protection, connector and cable sealing, sensor encapsulation, and battery overmolding. It delivers waterproofing up to IP69, chemical resistance, vibration damping, and strain relief, making it particularly suited to automotive electronics, industrial equipment, consumer devices, and medical applications. Its ability to replace potting, sealing, and conformal coating processes allows manufacturers to reduce steps, cut costs, and achieve superior design flexibility.
| Parameter | Specification |
|---|---|
| Machine Dimensions | 1050 × 780 × 1700 mm (41.33 × 30.70 × 66.92 in); 683 lbs |
| Electricity | 220 VAC, 1 Phase, 50/60 Hz, 25 A |
| Air Input | 90–110 PSI |
| Air Volume | 4 CFM |
| Clamping Method | Pneumatic |
| Clamping Force | 1.2 Tons |
| Clamping Stroke | 125 mm (Standard); 150 mm (Optional) |
| Max. Mold Size | 250 × 190 × 150 mm |
| Safety Features | Light Curtains, Emergency Stop, Two-Hand Door Interlocks, Lockout Tagout |
| Melt Tank | 7 L Square (Standard); 3 L Round (Optional) |
| Temperature Control | 2 Zones |
| Process Pressure Range | 20 – 500 psi |
| Viscosity Range of Adhesives | 1,000 – 10,000 cps |
| Operating Temperature Range | -65°C to +200°C |
| Waterproofing Standard | Meets IP65 – IP69 sealing requirements |
| Compliance | RoHS and REACH compliant; VOC-free, recyclable materials |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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Email: info@techniq.vn
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