Item Name: EP170
Manufacturer: Cemedine Co., Ltd.
Technologies: One-part heat curing epoxy adhesive (flexible type)
Color: Light yellow
Cure Type: Heat curing (110 °C × 60 min or 120 °C × 30 min)
Package Size: 1 kg
Shelf Life: Contact to Techniq VN for details.
CEMEDINE EP170 is a one-part, heat-curing flexible epoxy adhesive designed for applications requiring high peel resistance and non-sag performance. It provides elastic bonding suitable for materials that may experience thermal expansion or mechanical stress, while maintaining consistent adhesion after curing. Its heat-curing process allows controlled setting without mixing errors, ensuring reliability in demanding industrial or electronic applications.
Elastic bonding of metals and plastics in environments with mechanical vibration or thermal cycling.
Situations requiring high peel resistance and flexibility.
Non-sag applications on vertical or inclined surfaces.
Assembly of components where dimensional changes or stress variations occur.
| Property | EP170 (Not Mixed) | After Curing |
|---|---|---|
| Type | One-part heat curing epoxy adhesive (Flexible type) | Same |
| Base | Epoxy resin | Same |
| Appearance | Light yellow | Cured elastic solid |
| Viscosity (Pa·s, 23°C) | 170 | – |
| Density (g/cm³) | 1.13 | Same |
| Standard Curing | 110°C × 60 min / 120°C × 30 min | Fully cured |
| Tensile Shear Strength (MPa) | – | 15.1 |
| T-Peel Strength (N/mm) | – | 6.67 |
| Hardness | – | Shore D 55 |
| Glass Transition Temperature (°C) | – | 20 |
| Water Absorption Ratio (%) | – | 0.23 |
| Linear Expansion Coefficient | – | 30 ×10⁻⁵ /°C |
| Volume Resistivity (Ω·cm) | – | 3.0 ×10¹⁵ |
| Capacity | 1 kg | – |
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