Applications

Accessories
Adhesives
Cleaners
Equipment
Lubricants
Others
Primer, Activator
Solder Materials
Solvent
Tapes
Technology
Thermal Management

CEMEDINE EP330 – Fast-curing Two-part Epoxy Adhesive – Strong bonding for metals, plastics, automotive, electronics assembly

Item Name: CEMEDINE EP330
Manufacturer: CEMEDINE CO., LTD.
Technologies: Two-component epoxy adhesive (30-minute type, room temperature curing)
Color: Pink translucent (base resin), Light yellow translucent (hardener)
Cure Type: Room temperature curing, 1:1 mixing ratio
Package Size: 6 g set, 15 g set, 80 g set, 1 kg, 3 kg
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

CEMEDINE EP330 is a fast-curing, two-part epoxy adhesive suitable for room-temperature applications. It provides strong adhesion to a wide range of materials including metals and plastics, ensuring high durability, chemical resistance, and minimal shrinkage. EP330 is designed for rapid bonding and is ideal for applications requiring a short curing time while maintaining excellent mechanical and thermal performance.


2. Applications

  • Assembly and bonding of vehicles, electronic parts, and precision equipment.

  • Adhesion of composite members used in construction and sporting equipment.

  • Applications requiring fast curing and strong mechanical performance.

  • Adhesion to metals, plastics, and other common engineering materials.

3. Typical Properties

Property EP330
Type Two-part epoxy adhesive curing at room temperature
Base Epoxy resin / Polyamide
Appearance White / Gray / Light yellow translucent (depending on set)
Viscosity (Pa·s/23°C) 600 / 400 / 70
Density (g/cm³) 1.57 / 1.50 / 1.17
Mixing ratio 1:1
Standard curing 23°C × 24 hours
Pot life 30 minutes
Time for effective curing About 1 hour
Tensile shear strength (MPa) 17.5
T-peel strength (N/mm) 0.47
Hardness (Shore D) 82
Glass transition point (°C) 43
Coefficient of water absorption (%) 2.3
Coefficient of linear expansion 6.7 × 10⁻⁵
Volume resistivity (Ω·cm) 3.8 × 10¹¹
Capacity 320 mL set

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

RELATED PRODUCT

Contact Technical Support

Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.

(+84) 889 901 929

Email: info@techniq.vn

Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).

For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.