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Thermal Management

CEMEDINE SX720 ADHESIVE – Adhesive – Electrical Components

-Item Name: CEMEDINE SX720 ADHESIVE
-Manufacturer: Cemedine
-Technologies: Special polymer containing silyl group
-Color: White paste or Black paste (depending on the variant)
-Cure Type: Moisture cure at room temperature
-Package Size: 200g / 333ml
-Shelf Life: Contact to Techniq VN for details.

1. Product Overview

CEMEDINE SX720 is a non-flammable (UL94 V-0 listed), one-part, solventless adhesive designed for electrical components. It provides:

  • Quick curing at normal temperature
  • High initial adhesion and durability
  • Excellent electrical insulation
  • Environmentally friendly formulation (free from low-molecular siloxane, halogens, antimony oxide, phosphorus-based materials, and volatile solvents)

2. Applications

  • Fixing circuit boards, including condensers and coils
  • Sealing electronic components for waterproofing
  • Sealing power supplies and transformers for insulation
  • Prevention of electrical contact failures

3. Typical Properties

Before Curing (Single-Part Adhesive)

Property SX720W (RoHS) SX720WH (RoHS) SX720B (RoHS) SX720BH (RoHS)
Main Component Special polymer containing silyl group Special polymer containing silyl group Special polymer containing silyl group Special polymer containing silyl group
Appearance White paste White paste Black paste Black paste
Viscosity (Pa.s at 23°C) 45 85 45 85
Specific Gravity (g/cm³) 1.56 1.57 1.56 1.57
Tack-Free Time (min) 10 8 10 8

After Curing

Property SX720W (RoHS) SX720WH (RoHS) SX720B (RoHS) SX720BH (RoHS)
Tensile Shear Strength (N/mm²) 3.4 3.2 3.4 3.2
T-Peel Adhesion Strength (N/mm) 1.0 1.0 1.0 1.0
Hardness (Shore A) 78 81 78 82
Glass Transition Temperature (°C) -64 -69 -63 -69
Breaking Strength (N/mm²) 3.4 3.2 3.4 3.2
Breaking Elongation (%) 100 50 100 50
Linear Expansion Coefficient 1.1×10⁻⁴ 7.3×10⁻⁵ 8.7×10⁻⁵ 8.1×10⁻⁵

Electrical & Thermal Properties

Property SX720W (RoHS) SX720WH (RoHS) SX720B (RoHS) SX720BH (RoHS)
Volume Resistivity (Ω·cm) 2.1×10¹² 1.7×10¹² 2.3×10¹² 1.4×10¹²
Dielectric Constant (100Hz) 6.2 5.9 6.6 6.2
Dielectric Loss Tangent (100Hz) 0.23 0.31 0.27 0.28
Thermal Conductivity (W/m·K) 0.91 0.92 1.09 1.00

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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