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Chemtronics Chemask® – Solder Masking Agent – PCB Component Protection During Wave Soldering & Conformal Coating

Item Name: Chemtronics Chemask® (Product# CM8, CM1)
Manufacturer: Chemtronics
Technologies: Peelable solder masking agent, natural latex rubber
Color: Pink
Cure Type: Fast curing, ambient temperature (tack-free 15 min, full cure 30 min @ 25°C)
Package Size: CM8: 8 fl. oz. / 236 mL liquid; CM1: 1 gal. / 3.7 L liquid
Shelf Life: 2 years

1. Product Overview

Chemask® Solder Masking Agent is a fast-curing, peelable compound based on natural latex rubber. It provides temporary protection for printed circuit boards during wave soldering and conformal coating processes. With temperature stability up to 515°F (268°C), it cures quickly, is compatible with common fluxes and solvents, and leaves no residue after removal. The product is RoHS compliant, non-flammable, and environmentally safe with zero ODP (ozone depletion potential).


2. Applications

  • Protecting component-free areas during soldering

  • Shielding components, pin connectors, and sockets

  • Safeguarding temperature-sensitive components during wave soldering

  • Protecting board areas during conformal coating

3. Typical Properties

Property Before Use / Unmixed After Cure / Mixed (if applicable)
Base Material Natural latex rubber Peelable cured mask
Color Pink Pink (peelable)
Solvent Stability Stable in hydrocarbons, HFCs, water, chlorinated solvents Maintains integrity in solvents
Flux Compatibility All types Compatible with flux residues
Temperature Stability Up to 515°F (268°C)
Drying Time (Tack-Free) ~15 min @ 25°C (10 mils) Fully cured in ~30 min @ 25°C
Viscosity (@ 25°C) 20,000–28,000 cps (±500) Solid peelable mask
Solids Content ~60%
Flash Point Nonflammable Nonflammable
Weight/Gallon ~7.2 lbs.
Shelf Life 2 years
Removal Peelable by hand/tweezers

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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