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Devcon 5 Minute Epoxy – rapid-curing adhesive/encapsulant for metals, electronics, glass, ceramics, wood, and composites

Item Name: Devcon 5 Minute Epoxy
Manufacturer: ITW Performance Polymers
Technologies: Epoxy adhesive / encapsulant
Color: Light Amber
Cure Type: Ambient temperature, rapid-curing
Package Size: 25ml Dev-tube; 70g Twin-tube; 50ml Cartridge; 400ml Cartridge
Shelf Life: 3 years

1. Product Overview

Devcon 5 Minute Epoxy is a rapid-curing, general-purpose adhesive and encapsulant that forms a hard, rigid bond or coating within minutes. It is 100% reactive (solvent-free), offers good dielectric strength, and provides resistance against many solvents.


2. Applications

  • Quick metal-to-metal bonding and repairs.

  • Potting and encapsulation of electronic components and assemblies.

  • Bonding of metals, fabrics, ceramics, glass, wood, and concrete in various combinations.

3. Typical Properties

Unmixed / Mixed Properties

Property Value
Colour (Unmixed) Light Amber
Mix Ratio (by Volume & Weight) 1:1
Mixed Viscosity 10,000 cps
Mixed Density 1.10 g/cc
Working Time (28 g @ 23°C) 3–6 minutes
Fixture Time 10–15 minutes
Functional Cure @ 23°C 45–60 minutes
Full Cure 12 hours

Cured Properties (7 days @ 24°C)

Property Value
Adhesive Tensile Shear (ASTM D1002) 13 MPa
T-Peel 4–5 N/10 mm
Tensile Elongation 1%
Service Temperature (Dry) -40 to 93°C
Cured Hardness (ASTM D2240) 85D
Specific Volume 909 cm³/kg
Solids by Volume 100%
Dielectric Strength (ASTM D149) 19.6 kV/mm

Chemical Resistance (30 days immersion, RT cure)

Chemical Resistance
Acetic Acid (10%) Fair
Ammonia Excellent
Cutting Oil Excellent
Petrol (Unleaded) Poor
Hydrochloric Acid (10%) Poor
Kerosene Very Good
Mineral Spirits Excellent
Sodium Hydroxide (10%) Very Good
Acetone Poor
Corn Oil Excellent
Ethanol Excellent
Glycols/Antifreeze Excellent
Isopropanol Excellent
MEK Poor
Motor Oil Excellent
Sulphuric Acid (10%) Poor

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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