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DOWSIL™ 3-1953 – Conformal Coating – Electrical and electronic circuit protection applications

Brand Name: DOWSIL™ 3-1953 Conformal Coating

Available Sizes:

  • 3.6 kg (approximately 7.94 lbs) pails
  • 18.1 kg (approximately 39.9 lbs) pail

Shelf Life: Approximately 12 months (1 year) from the date of manufacture.

DOWSIL™ 3-1953 Conformal Coating is a one-part, translucent, medium-viscosity, solventless silicone elastomer designed for protecting rigid and flexible circuit boards, electronic printed wiring boards (PWB), sensitive components, and fine-pitched designs. It cures at room temperature with the option for mild heat acceleration, forming a soft, stress-relieving coating. The coating contains a UV indicator to facilitate inspection and is UL, IPC, and Mil Spec qualified.

Applications:

  • Protective coating for rigid and flexible circuit boards
  • Suitable for lighting, industrial, and automotive industries requiring various reliability standards
  • Ideal for electronic printed wiring boards (PWB), sensitive components, and fine-pitched designs

DOWSIL™ 3-1953 Conformal Coating

Typical Properties:

Property Unit Value
One or Two-part One
Color Translucent
Viscosity cP 350
Specific Gravity (Cured) 0.98
Non-Volatile Content (NVC) % 99.4
Tack-Free Time at 25ºC minutes 8
Tack-Free Time at 60ºC/15% RH minutes 0.5
Tensile Strength MPa 0.5
Elongation % 60
Durometer Shore A 34
Dielectric Strength kV/mm 17
Volume Resistivity ohm·cm 5.5 x 10¹⁵
Dissipation Factor at 100 Hz 0.0007
Dissipation Factor at 100 kHz <0.0002
Hardening Transition by DSC °C -49
UL Flammability Classification 94 V-0
Mil Specification Mil I-46058C Amend 7
Agency Listing IPC-CC-830A with Amendment 1, UL 746E
Cyclotetrasiloxane (D4) Content % <0.1

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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