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DOWSIL™ 3-1965 Conformal Coating – Silicone-based coating – Electrical insulation and protection for electronic assemblies

  • Brand Name: DOWSIL™ 3-1965 Conformal Coating

  • Package Size: Available in 3.6 kg pails and 18.1 kg pails.

  • Shelf Life: 12 months (1 year) from the date of manufacture.

Product Overview

DOWSIL™ 3-1965 Conformal Coating is a one-part, transparent, solventless, low-viscosity silicone coating designed to protect electronic assemblies from environmental factors. It cures to a soft, low-stress elastomer at room temperature, with the option for heat acceleration to expedite processing. The coating includes a UV indicator to facilitate inspection and is free of added solvents. It meets industry standards such as UL 94 V-0, MIL-I-46058C Amendment 7, and IPC-CC-830 Amendment 1.

 

Applications

DOWSIL™ 3-1965 Conformal Coating is suitable for use with:

  • Rigid and flexible circuit boards
  • Printed wiring boards (PWB)
  • Sensitive components and fine-pitch designs

Typical Properties

The typical properties of DOWSIL™ 3-1965 Conformal Coating are summarized in the following table:

Property Unit Value
Color Transparent
Viscosity cP (Pa·s) 115 (0.115)
Specific Gravity (Cured) 0.99
Tack-Free Time at 25°C minutes 6
Durometer Hardness Shore A 33
Dielectric Strength volts/mil (kV/mm) 425 (17)
Volume Resistivity ohm·cm 8.7 × 10¹⁴
Dissipation Factor at 100 Hz 0.001
Dissipation Factor at 100 kHz <0.0002
UL Flammability Classification 94 V-0
MIL Specification MIL-I-46058C Amendment 7
Agency Listing IPC-CC-830, Amendment 1

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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