1. Product Overview

DOWSIL™ 3-4150 is a two-part, transparent green dielectric gel with a 1:1 mix ratio that cures rapidly at room temperature. The individual components are supplied in blue and yellow to reduce mixing errors, and turn green upon proper blending. It delivers soft encapsulation with resilience, stress relief, and insulation, while maintaining the dimensional stability of an elastomer. The product is designed for fast curing without ovens, providing processing flexibility for both manual and automated dispensing systems.

2. Applications

• Encapsulation and potting of PCB system assemblies, including delicate components.

• Protection against moisture, contaminants, and high-voltage stress.

• Stress relief for circuits and interconnections during thermal and mechanical cycling.

• Thick-layer encapsulation for complex or high-architecture devices.

• Optoelectronic applications requiring refractive index stability.

• Repairable encapsulation where rework or partial component replacement is needed.