• Item Name: DOWSIL™ 3-4155 HV Dielectric Gel
• Manufacturer: Dow
• Technologies: Silicone dielectric gel, two-part addition-cure system
• Color: Mixed green (Part A – Blue, Part B – Yellow)
• Cure Type: Room temperature cure (heat accelerates)
• Package Size: 210 mL dual cartridges, 1 gallon pails, 5 gallon pails, 55 gallon drums
• Shelf Life: 12 months
DOWSIL™ 3-4155 HV is a two-part, soft, transparent green dielectric gel with 1:1 mix ratio and high viscosity. It cures quickly at room temperature without ovens and remains flexible in extreme low temperatures down to -80°C, while maintaining stability up to 200°C. Its soft, self-healing nature provides stress relief and insulation, making it well-suited for delicate electronics exposed to harsh environments. Blue and yellow parts mix to green, ensuring blending accuracy.
Encapsulation of PCB assemblies operating under very low temperatures.
Stress relief for components with CTE mismatch during thermal cycling.
Electrical insulation for high-voltage circuits.
Moisture and contaminant protection for sensitive devices.
Optoelectronic applications requiring stable refractive index.
Thick-layer encapsulation of high-architecture designs.
Reworkable systems where repair and patching may be needed.
| Property | Unit | Result |
|---|---|---|
| Still Not Mixed | ||
| Viscosity (Part A) | cP / mPa·s / Pa·s | 1850 / 1850 / 1.9 |
| Viscosity (Part B) | cP / mPa·s / Pa·s | 1875 / 1875 / 1.9 |
| After Mixed / Cured | ||
| Viscosity (Mixed) | cP / mPa·s / Pa·s | 1875 / 1875 / 1.9 |
| Cure Time @ 25°C | hours | 1 |
| Working Time @ 25°C (Snap Time) | minutes | 8 |
| Gel Hardness | grams | 60 |
| Dielectric Strength | volts/mil / kV/mm | 400 / 16 |
| Dielectric Constant @ 100 Hz | – | 2.96 |
| Dielectric Constant @ 100 kHz | – | 2.96 |
| Volume Resistivity | ohm·cm | 2.8 × 10¹⁴ |
| Dissipation Factor @ 100 Hz | – | 0.02 |
| Dissipation Factor @ 100 kHz | – | <0.0001 |
| Shelf Life @ 25°C | months | 12 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.