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Thermal Management

DOWSIL™ 3-6635 Dielectric Gel – Encapsulation and insulation for PCB assemblies under extreme low-temperature conditions

  • Item Name: DOWSIL™ 3-6635 Dielectric Gel

  • Manufacturer: Dow

  • Technologies: Silicone dielectric gel

  • Color: Clear

  • Cure Type: Heat cure

  • Package Size: 210 mL dual cartridges, 1 gallon pails, 5 gallon pails, 55 gallon drums

  • Shelf Life: 6 months

1. Product Overview

DOWSIL™ 3-6635 is a one-part, clear, heat-cured dielectric gel designed for low-temperature resilience and reliable electronic protection. It maintains flexibility from -80°C to 200°C, providing stress relief and cushioning against thermal and mechanical strains. With low viscosity for efficient flow under components, the gel cures into a soft, self-healing material that combines liquid-like stress relief with elastomeric stability, making it ideal for delicate electronic assemblies.


2. Applications

  • Encapsulation of PCB assemblies operating in extreme low temperatures.

  • Electrical insulation for high-voltage circuits.

  • Stress relief to mitigate CTE mismatch in electronic components.

  • Moisture and contaminant isolation for sensitive devices.

  • Optoelectronic applications requiring stress relief and stable refractive index.

  • Repairable encapsulation layers for PCB rework.

3. Typical Properties

Property Unit Result
Viscosity (Uncured) cP / mPa·s / Pa·s 700 / 700 / 0.7
Specific Gravity (Uncured) 1.0
Gel Time @ 135°C minutes 10.8
Rheometer T90 Cure Time @ 100°C minutes 48
Rheometer T90 Cure Time @ 125°C minutes 6.6
Rheometer T90 Cure Time @ 150°C minutes 6.4
Heat Cure Time @ 100°C minutes 120
Gel Hardness grams 70
Penetration 1/10 mm 85
Dielectric Strength volts/mil / kV/mm 525 / 20
Dielectric Constant @ 100 Hz 2.83
Dielectric Constant @ 100 kHz 2.84
Volume Resistivity ohm·cm 4.8 × 10¹³
Dissipation Factor @ 100 Hz 0.0002
Dissipation Factor @ 100 kHz <0.0001
Shelf Life @ 25°C months 6

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