1. Product Overview

DOWSIL™ 3-6635 is a one-part, clear, heat-cured dielectric gel designed for low-temperature resilience and reliable electronic protection. It maintains flexibility from -80°C to 200°C, providing stress relief and cushioning against thermal and mechanical strains. With low viscosity for efficient flow under components, the gel cures into a soft, self-healing material that combines liquid-like stress relief with elastomeric stability, making it ideal for delicate electronic assemblies.

2. Applications

• Encapsulation of PCB assemblies operating in extreme low temperatures.

• Electrical insulation for high-voltage circuits.

• Stress relief to mitigate CTE mismatch in electronic components.

• Moisture and contaminant isolation for sensitive devices.

• Optoelectronic applications requiring stress relief and stable refractive index.

• Repairable encapsulation layers for PCB rework.