Products

Henkel Loctite
3M
Bostik
Cemedine
Dowsil
Dymax
Elantas
HB Fuller
HumiSeal
Huntsman
ITW
Kyzen
Macdermid Alpha
Molykote
Momentive
Parker Lord
Permabond
Shin-Etsu
Wevo Chemie
Zestron

DOWSIL™ 340 – Heat Sink Compound – Thermal interface for electronic components and heat dissipation applications

Brand: DOWSIL™ 340 Heat Sink Compound. It is produced by Dow, formerly known as Dow Corning.

Available Sizes:

  • 5 oz (142 g) Tube
  • 13.5 oz (383 g) Cartridge
  • 20 lb (9 kg) Pail
  • 275 lb (124.7 kg) Drum

Shelf Life: The compound has a shelf life of 60 months (5 years) from the date of manufacture.

DOWSIL™ 340 Heat Sink Compound:

1. Product Overview

DOWSIL™ 340 Heat Sink Compound is a white, non-curing, non-flowing silicone-based thermal interface material. It is heavily filled with heat-conductive metal oxides, providing moderate thermal conductivity and high-temperature stability. This compound is designed to maintain a positive heat sink seal, enhancing heat transfer from electronic devices to heat sinks, thereby improving overall device efficiency.

2. Applications

  • Thermal Coupling: Facilitates efficient heat transfer between electrical/electronic devices and heat sinks.
  • Mounting Aid: Applied to the base and mounting studs of transistors, diodes, and silicon-controlled rectifiers to improve thermal performance.
  • Heat Dissipation: Enhances heat flow away from circuitry components, potentially increasing reliability.

DOWSIL™ 340 Heat Sink Compound:

Typical Properties

Property Unit Value
Color White
Viscosity cP (Pa·s) 542,000 (542)
Specific Gravity (Uncured) 2.1
Bleed % 0.23
Thermal Conductivity W/m·K 0.67
Thermal Resistance at 40 psi °C·cm²/W 0.16
Penetration (Worked) 1/10 mm 290
Evaporation % 0.38
Shelf Life at 38°C months 60

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

RELATED PRODUCT

Contact Technical Support

Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.

(+84) 889 901 929

Email: info@techniq.vn

Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).

For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.