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DOWSIL™ 340 Heat Sink Compound

Brand: DOWSIL™ 340 Heat Sink Compound. It is produced by Dow, formerly known as Dow Corning.

Available Sizes:

  • 5 oz (142 g) Tube
  • 13.5 oz (383 g) Cartridge
  • 20 lb (9 kg) Pail
  • 275 lb (124.7 kg) Drum

Shelf Life: The compound has a shelf life of 60 months (5 years) from the date of manufacture.

DOWSIL™ 340 Heat Sink Compound:

1. Product Overview

DOWSIL™ 340 Heat Sink Compound is a white, non-curing, non-flowing silicone-based thermal interface material. It is heavily filled with heat-conductive metal oxides, providing moderate thermal conductivity and high-temperature stability. This compound is designed to maintain a positive heat sink seal, enhancing heat transfer from electronic devices to heat sinks, thereby improving overall device efficiency.

2. Applications

  • Thermal Coupling: Facilitates efficient heat transfer between electrical/electronic devices and heat sinks.
  • Mounting Aid: Applied to the base and mounting studs of transistors, diodes, and silicon-controlled rectifiers to improve thermal performance.
  • Heat Dissipation: Enhances heat flow away from circuitry components, potentially increasing reliability.

DOWSIL™ 340 Heat Sink Compound:

Typical Properties

Property Unit Value
Color White
Viscosity cP (Pa·s) 542,000 (542)
Specific Gravity (Uncured) 2.1
Bleed % 0.23
Thermal Conductivity W/m·K 0.67
Thermal Resistance at 40 psi °C·cm²/W 0.16
Penetration (Worked) 1/10 mm 290
Evaporation % 0.38
Shelf Life at 38°C months 60

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