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DOWSIL™ 7091 Adhesive Sealant – One-component silicone sealant – Sealing and bonding in construction and industrial applications

DOWSIL™ 7091 Adhesive Sealant is a one‑part, moisture‑curing silicone adhesive sealant engineered for applications such as formed‑in‑place gaskets in automotive and electronic assemblies.

Available Sizes: 5‑oz tubes, 13.5‑oz cartridges, and 20‑lb pails.

Shelf Life: Approximately 12 months (1 year) from the date of manufacture.

DOWSIL™ 7091 Adhesive Sealant is a high-performance, one-part silicone adhesive/sealant that cures at room temperature upon exposure to moisture, forming a tough and flexible rubber. It utilizes an alkoxy cure system and exhibits non-sag, paste-like consistency, making it easy to apply. This sealant offers excellent adhesion to a variety of substrates and remains stable and flexible over a wide temperature range.

Applications:

  • Ideal for bonding materials with differing thermal expansion rates, such as glass to metal or glass to plastic.

  • Provides unprimed adhesion to commonly used materials, including enameled and painted steel, aluminum, ceramic, glass, and certain engineering plastics.

  • Suitable for use as a Formed-in-Place Gasket (FIPG) material.

Typical Properties:

Property Unit Value
Appearance Non-slump paste
Colors Black, white, gray
Extrusion Rate g/minute 185
Skin-Over Time minutes 15
Tack-Free Time minutes 28
Durometer Hardness (Shore A) 32
Tensile Strength MPa 2.5
Elongation at Break % 680
Tear Strength (Die B) kN/m 15
Specific Gravity at 22°C (72°F) 1.4

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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