Product Overview
DOWSIL™ CN-8760 G Thermally Conductive Encapsulant is a two-part, 1:1 mix ratio silicone elastomer designed for efficient heat dissipation and protection of electronic components. It offers room temperature curing with the option to accelerate the process through heat, providing flexibility in manufacturing. The encapsulant exhibits low viscosity and good flowability, facilitating easy mixing and application, which is beneficial for fast processing and short cycle times. Additionally, it is UL 94 V-0 certified, indicating excellent flame resistance.
Applications
This encapsulant is suitable for a variety of applications, including:
Typical Properties
The typical properties of DOWSIL™ CN-8760 G Thermally Conductive Encapsulant are as follows:
| Property | Unit | Value |
|---|---|---|
| Color | – | Gray |
| Viscosity (Part A) | cP (Pa·s) | 2,900 (2.9) |
| Viscosity (Part B) | cP (Pa·s) | 3,200 (3.2) |
| Viscosity (Mixed) | cP (Pa·s) | 3,200 (3.2) |
| Thermal Conductivity | W/m·K | 0.67 |
| Specific Gravity (Cured) | – | 1.58 |
| Working Time at 25°C (Pot Life) | minutes | 100 |
| Cure Time at 25°C | hours | 24 |
| Durometer | Shore A | 45 |
| Dielectric Strength | volts/mil (kV/mm) | 625 (24) |
| Volume Resistivity | ohm·cm | 1.0 × 10¹⁶ |
| Dielectric Constant at 100 Hz | – | 2.88 |
| Dielectric Constant at 100 kHz | – | 2.66 |
| Dissipation Factor at 100 Hz | – | 0.03 |
| Dissipation Factor at 100 kHz | – | 0.06 |
| UL 94 Flame Classification | – | V-0 |
| UL RTI Rating | °C | 150 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.