DOWSIL™ EA-4600 HM RTV Black UV is a one-component, neutral-cure silicone hot-melt adhesive designed for PCB system assembly. It provides instant green strength, excellent adhesion to various substrates, and long open time. The adhesive is UL 94 rated and operates within a temperature range of -45°C to 150°C (-50°F to 300°F).
Key Features:
| Property | Test Method | Unit | Result |
|---|---|---|---|
| Viscosity at 120°C | CTM 1134 | Pa.s | 60 |
| Nonvolatile Content | CTM 0839 | % | >98.5 |
| Open Time (Assembly Time) | CTM 0243 | Minutes | 15 |
| Pot Life at 120°C | CTM 0243 | Days | 1 |
| Lap Shear Adhesion on PC (30min/1hr/1day/3days/7days) | CTM 0243 | MPa | 0.1/0.1/0.5/1.1/1.7 |
| Durometer (Shore A) | ASTM C661 | Points | 56 |
| Tensile Strength | ASTM D412 | MPa | 4.6 |
| Elongation | ASTM D412 | % | 1000 |
| 180° Peel Strength (1 day) | – | pli | 20 |
| Specific Gravity (Uncured) | CTM 0022 | – | 1.08 |
| Appearance | CTM 0176 | – | Black |
| Service Temperature Range | ASTM C711 | °C | -45 to 150 |
| Dielectric Strength | CTM 0114 | Volts/mil (kV/mm) | 496 (20) |
| Volume Resistivity | CTM 0249 | Ohm-cm | 5.7E+14 |
| Dielectric Constant (100Hz / 100kHz / 1MHz) | CTM 0112 | – | 2.68 / 2.64 / 2.63 |
| Dissipation Factor (100Hz / 100kHz / 1MHz) | CTM 0112 | – | 0.004 / 0.002 / 0.002 |
| Thermal Conductivity | – | W/mK | 0.17 |
| Thermal Diffusivity | – | mm²/s | 0.11 |
| Specific Heat | – | MJ/m³K | 1.6 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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