DOWSIL™ EA-5151 QiC Assembly Adhesive Clear is a one-component, neutral-cure, heat-assisted silicone adhesive with instant green strength. It offers high transparency, UV stability, and primerless adhesion to various substrates. The adhesive cures via moisture reaction and can be used with standard heat-assisted dispensing equipment.
This adhesive is designed for automotive electronics, industrial, and energy control applications, including:
| Property | Unit | Value |
|---|---|---|
| Appearance | – | Clear |
| Specific Gravity (uncured) | – | 1.08 |
| Viscosity at 100°C | Pa·s | 200 |
| Viscosity at 120°C | Pa·s | 70 |
| Non-volatile Content | % | >98.5 |
| Open Time | min | 15 |
| Lap Shear Adhesion (Aluminum, 21 Days) | MPa | 1.15 |
| Lap Shear Adhesion (FR4/PC/PMMA/PTFE, 21 Days) | MPa | 1.0 / 0.9 / 0.8 / 0.7 |
| Durometer (Shore A) | points | 60 |
| Ultimate Tensile Strength | MPa | 4.3 |
| Ultimate Elongation | % | 1300 |
| Linear Coefficient of Thermal Expansion (CTE) | ppm/°C | 230 |
| Dielectric Strength | kV/mm | 24 |
| Volume Resistivity | ohm·cm | 1E+16 |
| Dielectric Constant (100 Hz / 100 kHz) | – | 2.82 / 2.60 |
| Dissipation Factor (100 Hz / 100 kHz) | – | 0.0095 / 0.0012 |
| Light Transmittance (380 nm / 450 nm / 760 nm, 1 mm thickness) | % | 94 / 94 / 94 |
| Service Temperature | °C | -50 to 150 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
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