DOWSIL™ EA-7100 is a one-part, thermal radical cure adhesive designed for strong adhesion to a wide range of substrates. It provides faster cure times, low voiding, and excellent adhesion in harsh environments.
| Property | Unit | Value |
|---|---|---|
| Viscosity | cP | 360,000 |
| Thixotropy | – | 5.8 |
| Pre-Assembly Time | min | 60 |
| Heat Cure Time @ 100°C | min | 15 |
| Specific Gravity (Cured) | – | 1.09 |
| Tensile Strength | psi (MPa) | 490 (3.4) |
| Elongation | % | 260 |
| Durometer (Shore A) | – | 43 |
| Lap Shear Strength (Aluminum) | psi (MPa) | 350 (2.4) |
| Lap Shear Strength (PBT) | psi (MPa) | 375 (2.6) |
| CTE (Coefficient of Thermal Expansion) | ppm/°C | 247 |
| Volume Resistivity | Ohm-cm | 9E+14 |
| Dielectric Strength | volts/mil (kV/mm) | 437 (17) |
| Dielectric Constant (100 Hz / 100 kHz) | – | 2.96 / 2.91 |
| Dissipation Factor (100 Hz / 100 kHz) | – | 0.002 / 0.004 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.