Brand Name: DOWSIL™ EA-9187LH Conformal Coating
Package Size: Available in 18 kg pails.
Shelf Life: Specific shelf life information is not provided in the available sources
1. Product Overview
DOWSIL™ EA-9187LH Conformal Coating is a one-part, clear, medium-viscosity, solventless silicone coating designed to protect printed circuit boards (PCBs) and sensitive electronic components. It cures at room temperature with optional heat acceleration and includes a UV indicator for inspection purposes. The coating is UL 746E qualified, ensuring compliance with industry safety standards.
2. Applications
This conformal coating is suitable for use in the lighting, industrial, and automotive sectors. It provides protective coverage for both rigid and flexible PCBs, safeguarding sensitive components and accommodating fine-pitched designs.
3. Typical Properties
| Property | Unit | Value |
|---|---|---|
| Appearance | — | Clear |
| Viscosity | mPa·s | 442 |
| Skin Over Time at 25°C | minutes | 7 |
| Specific Gravity (Uncured) | — | 0.98 |
| Non-Volatile Content | % | 97 |
| Durometer Hardness | Shore A | 21 |
| Tensile Strength | MPa | 0.25 |
| Elongation | % | 100 |
| Unprimed Lap Shear (Aluminum) | MPa | 0.24 |
| Dielectric Strength | kV/mm | 16.61 |
| Volume Resistivity | ohm·cm | 1.62 × 10¹⁵ |
| Dielectric Constant at 100 Hz | — | 1.76 |
| Dissipation Factor at 100 Hz | — | 0.02 |
| Dielectric Constant at 100 kHz | — | 1.73 |
| Dissipation Factor at 100 kHz | — | 0.001 |
| UL Flammability Classification | — | 94 V-0 |
| Agency Listing | — | UL 746E |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.