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DOWSIL™ EA-9189 H – Adhesive/Sealant – Bonding and sealing for electronic and electrical assemblies

Brand: DOWSIL™ EA-9189 H is a one‐part, white alkoxy cure RTV adhesive marketed under the Dowsil brand by Dow.

Available Sizes: One commonly available format is a 330 mL cartridge.

Shelf Life: approximately 9 months.

DOWSIL™ EA-9189 H White RTV Adhesive:

1. Product Overview

DOWSIL™ EA-9189 H White RTV Adhesive is a one-part, white, alkoxy-cure silicone adhesive. It offers ease of use with no mixing required and features a fast tack-free time of approximately 2 minutes. This adhesive is UL 94V-0 recognized, indicating its flame-retardant properties.

2. Applications

This adhesive is suitable for use as a module assembly adhesive, providing reliable bonding in electronic components and assemblies.

DOWSIL™ EA-9189 H White RTV Adhesive:

3. Typical Properties

Property Unit Value
Color White
Specific Gravity (Cured) 1.68
Tack-Free Time at 25°C minutes 2
Tensile Strength psi (MPa) 576 (3.9)
Elongation % 32
Durometer (Shore A) 80
Unprimed Adhesion – Lap Shear to Aluminum psi (MPa) 327 (2.2)
Unprimed Adhesion – Lap Shear to Copper psi (MPa) 343 (2.3)
Unprimed Adhesion – Lap Shear to Polycarbonate (PC) psi (MPa) 187 (1.2)
Unprimed Adhesion – Lap Shear to FR4 psi (MPa) 349 (2.4)
Thermal Conductivity W/m·K 0.88
Volume Resistivity ohm·cm 3.3 × 10¹⁵
Dielectric Constant @ 100 kHz 2.59
Dissipation Factor @ 100 kHz 0.009
Dielectric Strength volts/mil (kV/mm) 700 (28)
UL Flammability Classification 94V-0

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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