Item Name: DOWSIL™ EE-1010 Low Viscosity Encapsulant
Manufacturer: The Dow Chemical Company
Technologies: Two-part polydimethylsiloxane silicone elastomer
Color: Part A – Not specified, Part B – Not specified (different colors for identification)
Cure Type: Room temperature or heat accelerated cure
Package Size: Contact to Techniq VN for details
Shelf Life: Contact to Techniq VN for details
DOWSIL™ EE-1010 is a two-part, 1:1 mix, low-viscosity silicone encapsulant designed for PCB system protection. It cures at room temperature or can be heat accelerated, producing a flexible, high-durometer elastomer with moderate thermal conductivity. Its long working time allows air displacement without vacuum de-airing, while the low viscosity ensures flow into narrow and complex geometries. The cured material offers strong dielectric insulation, stable performance across –45 °C to +200 °C, and repairability compared to rigid potting compounds.
Encapsulation of complex or high-density PCB assemblies requiring void-free coverage.
Manufacturing processes with frequent stops/starts where extended working time is beneficial.
Manual or automated dispensing and meter-mixing applications.
Situations requiring rework or repair, since the cured silicone can be cut and repotted.
| Property | Unit | Result |
|---|---|---|
| Still Not Mixed (Uncured) | ||
| One or Two Part | – | Two part |
| Mix Ratio | – | 1:1 |
| Viscosity Part A | cP | 1020 |
| Viscosity Part B | cP | 600 |
| Viscosity (Mixed) | cP | 840 |
| Specific Gravity (Part A / Part B) | – | 1.26 / 1.25 |
| After Mixed / Cured | ||
| Pot Life (25 °C) | minutes | 50 |
| Snap Time (25 °C) | hours | 4.2 |
| Cure Time (25 °C) | hours | 24 |
| Heat Cure @ 100 °C / 150 °C | minutes | 3 / 2 |
| Specific Gravity | – | 1.25 |
| Durometer | Shore A | 60 |
| Dielectric Strength | V/mil (kV/mm) | 450 (18) |
| Volume Resistivity | ohm·cm | 1.19 × 10¹⁵ |
| Dielectric Constant @ 100 kHz / 1 MHz | – | 3.17 / 3.17 |
| Dissipation Factor @ 100 Hz / 100 kHz / 1 MHz | – | 0.017 / 0.001 / 0.002 |
| Thermal Conductivity | W/m·K | 0.35 |
| Linear CTE | ppm/°C | 300 |
| Glass Transition (DSC) | °C | –50 |
| Service Temperature Range | °C | –45 to +200 (short-term –55) |
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