Applications

DOWSIL™ EE-9000 Primerless RTV Encapsulant – Electrical PCB encapsulation with dielectric protection and energy-saving room temperature cure

Item Name: DOWSIL™ EE-9000 Primerless RTV Encapsulant
Manufacturer: Dow
Technologies: Two-part silicone encapsulant (10:1 mix ratio, primerless adhesion)
Color: White
Cure Type: Room temperature cure (heat accelerated optional)
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

DOWSIL™ EE-9000 Primerless RTV Encapsulant is a two-part, 10:1 mix ratio, white flowable encapsulant designed for electrical and PCB system assemblies. It offers primerless adhesion, excellent dielectric performance, and cures at room temperature without the need for ovens, resulting in energy savings. The material cures into a flexible elastomer with consistent performance across a wide range of thicknesses and does not require post-curing.


2. Applications

  • Protection of electrical PCB system assemblies requiring self-priming adhesion.

  • Potting and encapsulation in electronics where ease of repair, dielectric strength, and thermal stability are important.

  • Suitable for devices needing long-term serviceability in challenging temperature ranges (-45°C to 200°C).

3. Typical Properties

Property Unit Still Not Mixed (Part A) After Mixed
One or Two Part Two Two
Color White White
Viscosity cP / Pa·s 3600 / 3.6 2600 / 2.6
Mix Ratio 10:1
Working Time at 25°C (Pot Life) minutes 130
Thermal Conductivity btu/hr·ft·°F / W/mK 0.116 / 0.2
Durometer Shore A 16
Dielectric Strength volts/mil / kV/mm 575 / 23
Volume Resistivity ohm·cm 5E+15
Dissipation Factor at 1 MHz 0.002
Dielectric Constant at 1 MHz 3.2

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