• Item Name: DOWSIL™ EE-9000 Primerless RTV Encapsulant
• Manufacturer: Dow
• Technologies: Two-part silicone encapsulant (10:1 mix ratio, primerless adhesion)
• Color: White
• Cure Type: Room temperature cure (heat accelerated optional)
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
DOWSIL™ EE-9000 Primerless RTV Encapsulant is a two-part, 10:1 mix ratio, white flowable encapsulant designed for electrical and PCB system assemblies. It offers primerless adhesion, excellent dielectric performance, and cures at room temperature without the need for ovens, resulting in energy savings. The material cures into a flexible elastomer with consistent performance across a wide range of thicknesses and does not require post-curing.
Protection of electrical PCB system assemblies requiring self-priming adhesion.
Potting and encapsulation in electronics where ease of repair, dielectric strength, and thermal stability are important.
Suitable for devices needing long-term serviceability in challenging temperature ranges (-45°C to 200°C).
| Property | Unit | Still Not Mixed (Part A) | After Mixed |
|---|---|---|---|
| One or Two Part | – | Two | Two |
| Color | – | White | White |
| Viscosity | cP / Pa·s | 3600 / 3.6 | 2600 / 2.6 |
| Mix Ratio | – | 10:1 | – |
| Working Time at 25°C (Pot Life) | minutes | – | 130 |
| Thermal Conductivity | btu/hr·ft·°F / W/mK | – | 0.116 / 0.2 |
| Durometer | Shore A | – | 16 |
| Dielectric Strength | volts/mil / kV/mm | – | 575 / 23 |
| Volume Resistivity | ohm·cm | – | 5E+15 |
| Dissipation Factor at 1 MHz | – | – | 0.002 |
| Dielectric Constant at 1 MHz | – | – | 3.2 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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