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DOWSIL™ HC 1000 Gray Conformal Coating – Flame-resistant silicone coating for PCB insulation and harsh environment protection

Item Name: DOWSIL™ HC 1000 Gray Conformal Coating
Manufacturer: Dow Chemical Company
Technologies: One-part polydimethylsiloxane conformal coating
Color: Gray
Cure Type: Room temperature cure, moisture-activated with mild heat acceleration
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

DOWSIL™ HC 1000 is a one-part, solventless, gray conformal coating formulated from polydimethylsiloxane. It cures at room temperature into a soft, low-stress elastomer with a UL 94 V-0 flammability rating, offering flame resistance and controlled volatility. The material adheres well to many solder types, resists moisture, vibration, and harsh conditions, and provides excellent dielectric insulation. With rapid tack-free curing and optional mild heat acceleration, it enhances reliability in electronic assemblies while remaining reworkable.


2. Applications

  • PCB system assemblies

  • Electrical appliances requiring dielectric insulation

  • Protection against moisture, vibration, and environmental stress

  • Circuits where pigmented coating is desired to hinder component identification

3. Typical Properties

Property Condition Value
Part Type One-part
Color Gray
Viscosity 12,000 cP (12 Pa·s)
Specific Gravity (Cured) 1.07
Non-Volatile Content 97.6%
Tack-Free Time 25°C 11 min
Cure Time Room Temp 0.5 h
Hardness Shore A 24
Dielectric Strength JIS K 6249 525 V/mil (21 kV/mm)
Volume Resistivity JIS K 6249 2.0 × 10¹⁵ Ω·cm
Dielectric Constant 1 MHz 3.2
Dissipation Factor 1 MHz 0.003
Flammability UL 94 V-0
Operating Temp. Range -45 to 200°C

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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