Brand: DOWSIL™ OS-10 Fluid; OS-20 Fluid; OS-30 Fluid developed by Dow (marketed under the Dowsil brand).
1. DOWSIL™ OS-10 Fluid
Package Size: Available in 500 mL bottles, 2.8 kg pails, 15 kg pails, and 150 kg drums.
2. DOWSIL™ OS-20 Fluid
Package Size: Available in 500 mL bottles, 3.1 kg pails, and 15 kg pails.
3. DOWSIL™ OS-30 Fluid
Package Size: Available in 500 mL bottles, 3.2 kg pails, 15 kg pails, and 150 kg drums.
Shelf Life: 36 months (3 years) from the date of manufacture.
DOWSIL™ OS-10, OS-20, and OS-30 Fluids are ozone-safe volatile methylsiloxane (VMS) compounds developed specifically for use as precision cleaning agents and carriers. These clear, colorless, and odorless fluids are compatible with most plastics and surface coatings, exhibit low toxicity, and evaporate completely at room temperature without leaving residues. Their low surface tension allows them to effectively clean surfaces, including intricate components, and they are non-irritating to the skin.
Applications:
Typical Properties:
| Property | Unit | OS-10 Fluid | OS-20 Fluid | OS-30 Fluid |
|---|---|---|---|---|
| Flash Point, Closed Cup | °C (°F) | -3 (27) | 34 (94) | 57 (135) |
| Boiling Point at 760 mm Hg | °C (°F) | 100 (212) | 152 (306) | 194 (381) |
| Vapor Pressure at 25°C (77°F) | mm Hg | 42.2 | 3.9 | 0.43 |
| Latent Heat at Boiling Point | cal/g (BTU/lb) | 46 (83) | 36 (66) | 31 (56) |
| Latent Heat at 25°C (77°F) | cal/g (BTU/lb) | 54 (97) | 47 (85) | 42 (76) |
| Drying Rate (Butyl Acetate = 1) | 3.8 | 0.7 | 0.14 | |
| Viscosity at 25°C (77°F) | cP | 0.5 | 0.8 | 1.3 |
| Specific Gravity at 25°C (77°F) | 0.76 | 0.82 | 0.85 | |
| Surface Tension at 25°C (77°F) | dynes/cm | 15.2 | 16.5 | 17.3 |
| Freezing Point | °C (°F) | -68 (-90) | -82 (-115) | -68 (-90) |
| Kauri-Butanol Value | 17 | 15 | 13 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.