DOWSIL™ Q1-9226 is a two-part, semi-flowable thermally conductive silicone adhesive designed for heat dissipation in electronic and automotive applications. It offers:
DOWSIL™ Q1-9226 is used for thermal management in electronic assemblies. Common applications include:
| Property | Part A | Part B |
|---|---|---|
| Color | Gray | Gray |
| Viscosity (cP) | 48,000 | 43,000 |
| Property | Unit | Result |
|---|---|---|
| Mixed Viscosity | cP | 59,000 |
| Specific Gravity (Cured) | – | 2.14 |
| Hardness | Shore A | 67 |
| Tensile Strength | psi / MPa | 600 / 4.15 |
| Elongation | % | 124 |
| Unprimed Adhesion – Lap Shear (Al) | psi / MPa | 375 / 2.6 |
| Dielectric Strength | volts/mil | 630 |
| Thermal Conductivity | W/m·K | 0.8 |
| Usable Temperature Range | °C | -45 to 200 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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