Item Name: DOWSIL™ Q1-9226 Thermally Conductive Adhesive
Manufacturer: The Dow Chemical Company
Technologies: Two-part silicone adhesive with thermally conductive filler
Color: Gray
Cure Type: Heat-accelerated addition cure
Package Size: Contact to Techniq VN for details
Shelf Life: Contact to Techniq VN for details
1. Product Overview
DOWSIL™ Q1-9226 Thermally Conductive Adhesive is a two-part, semi-flowable silicone adhesive with a 1:1 mix ratio. It features accelerated heat cure, long pot life, and self-priming adhesion to many substrates, including metals, ceramics, epoxy laminates, and filled plastics. Designed for thermal management, the adhesive forms a thermal “bridge” to efficiently transfer heat from devices to heat sinks. Its combination of high thermal conductivity, low thermal resistance, and ability to achieve thin bond line thicknesses makes it suitable for compact, high-performance electronic assemblies.
2. Applications
DOWSIL™ Q1-9226 is typically used for bonding organic and ceramic substrates to heat sinks, particularly in automotive control modules. It is suitable for PCB system assemblies requiring thermal management and reliable adhesion without primers on many reactive substrates. Application methods include automated or manual dispensing. The adhesive supports deep-section cures and can be used where confined or thick-layer bonding is required.
3. Typical Properties
| Property | Unit | Part A | Part B | Mixed |
|---|---|---|---|---|
| One Part or Two Part | — | — | — | Two |
| Color | — | — | — | Gray |
| Viscosity | cP / Pa·s / mPa·s | 48,000 / 48 / 48,000 | 43,000 / 43 / 43,000 | 59,000 / 59 / 59,000 |
| Specific Gravity (Cured) | — | — | — | 2.14 |
| Durometer Shore A | — | — | — | 67 |
| Tensile Strength | psi / MPa / kg/cm² | — | — | 600 / 4.15 / 42 |
| Elongation | % | — | — | 124 |
| Unprimed Adhesion – Lap Shear (Al) | psi / MPa / N/cm² | — | — | 375 / 2.6 / 260 |
| Dielectric Strength | volts/mil / kV/mm | — | — | 630 / 25 |
| Thermal Conductivity (Hot Disk) | btu/hr-ft-°F / W/m·K | — | — | 0.46 / 0.8 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.