1. Product Overview
DOWSIL™ Q1-9226 Thermally Conductive Adhesive is a two-part, semi-flowable silicone adhesive with a 1:1 mix ratio. It features accelerated heat cure, long pot life, and self-priming adhesion to many substrates, including metals, ceramics, epoxy laminates, and filled plastics. Designed for thermal management, the adhesive forms a thermal “bridge” to efficiently transfer heat from devices to heat sinks. Its combination of high thermal conductivity, low thermal resistance, and ability to achieve thin bond line thicknesses makes it suitable for compact, high-performance electronic assemblies.
2. Applications
DOWSIL™ Q1-9226 is typically used for bonding organic and ceramic substrates to heat sinks, particularly in automotive control modules. It is suitable for PCB system assemblies requiring thermal management and reliable adhesion without primers on many reactive substrates. Application methods include automated or manual dispensing. The adhesive supports deep-section cures and can be used where confined or thick-layer bonding is required.