1. Product Overview
DOWSIL™ SC 102 Compound is a one-part, white, non-curing, non-flowing thermally conductive silicone compound composed of filled polydimethylsiloxane. It offers moderate thermal conductivity and efficiently conducts heat away from critical components without the need for ovens or curing. The compound maintains low bleed, high-temperature stability, and forms a positive heat sink seal, enhancing heat transfer from devices and PCB assemblies to heat sinks or chassis. Its grease-like consistency allows thin bond line thicknesses, supporting compact, high-performance electronic designs while improving device reliability and operational efficiency.

2. Applications
DOWSIL™ SC 102 Compound is primarily used for thermal management in PCB system assemblies across computer, power supply, and automotive applications. It acts as a thermal “bridge” to efficiently remove heat from devices to the ambient via heat sinks. Application methods include squeegee or stencil application, screen printing, or spreading bulk material with a spatula. It is resistant to minimal or intermittent solvent exposure but should ideally be protected from solvents.