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Thermal Management

DOWSIL™ SC 4471 CV Thermally Conductive – Silicone adhesive – Thermal management and bonding in electronic components

  • Technology: Thermally Conductive Silicone Compound
  • Brand Name: DOWSIL™ SC 4471 CV Thermally Conductive Compound
  • Manufacturer: Dow Chemical Company
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

DOWSIL™ SC 4471 CV is a white, non-curing, flowable thermally conductive compound designed for effective heat dissipation in PCB system assemblies. It features controlled volatility, low oil bleed, and good thermal conductivity, making it ideal for applications requiring stable thermal management without the need for curing.

2. Applications

  • Thermal management for PCB system assembly modules in automotive control units and inverter units.
  • Heat dissipation enhancement for high-performance consumer and industrial electronic devices.
  • Thermal interface material for heat sinks, improving efficiency and reliability in compact electronic designs.

3. Typical Properties

Property Unit Result
Type One-part
Color White
Viscosity cP / mPa-sec / Pa-sec 116,000 / 116,000 / 116
Specific Gravity 2.76
Volatile Content (105°C, 24 hrs) wt% 0.11
Oil Separation (105°C, 24 hrs) wt% 0.02
Thermal Conductivity W/mK 2.0
Thermal Conductivity BTU/hr-ft-°F 1.16
Volume Resistivity Ohm·cm 2E+15

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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