Applications

DOWSIL™ SE 1700 – Adhesive – Sealing & Bonding Applications

  • Item Name: DOWSIL™ SE 1700 Adhesive
  • Manufacturer: Dow
  • Technologies: Polydimethylsiloxane adhesive
  • Color: Translucent or White
  • Cure Type: Heat cure
  • Package Size: Contact to Techniq VN for details.
  • Shelf Life: 18 months

1. Product Overview

DOWSIL™ SE 1700 is a two-part, heat-cure, non-flowing silicone adhesive designed for high tensile strength applications. It offers good working time, rapid cure processing, and long-term reliability in PCB and electronics applications.

2. Applications

  • Sealing ceramic condensers
  • Sealing PCB components
  • Bonding agent for keypads of PCs

3. Typical Properties

Property Unit Value
Viscosity (Mixed) cP 542,000
Working Time @ 25°C Hours 8
Heat Cure Time @ 150°C Minutes 30
Specific Gravity (Cured) 1.13
Tensile Strength psi / MPa 985 / 6.8
Elongation % 355
Durometer Hardness (Shore A) 48
Lap Shear Strength to Aluminum psi / MPa 390 / 2.7
Dielectric Strength Volts/mil 550
Volume Resistivity ohm·cm 5.0E+14
Dielectric Constant @ 1 MHz 3.0
Dissipation Factor @ 1 MHz 0.001
Shelf Life @ 25°C Months 18

Additional Notes

  • Curing: Addition-curing, accelerated with heat.
  • Adhesion: Excellent on metals, ceramics, and glass without primers.
  • Temperature Range: -45°C to 200°C (long-term), -55°C possible with testing.
  • Compatibility: Avoid exposure to sulfur-containing materials and organotin compounds.
  • Solvent Resistance: Withstands intermittent solvent exposure but not continuous contact.

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