Applications

DOWSIL™ SE 1740 Encapsulant – Two-part clear silicone encapsulant for PCB protection and electrical assembly

Item Name: DOWSIL™ SE 1740 Encapsulant
Manufacturer: The Dow Chemical Company
• Technologies: Two-part, 1:1 mix, primerless silicone elastomer
Color: Clear
Cure Type: Heat cure, room temperature possible
Package Size: 0.45, 3.6, 18, 200 kg containers (varies by product)
Shelf Life: 12 months

1. Product Overview
DOWSIL™ SE 1740 Encapsulant is a two-part, 1:1 mix, clear silicone encapsulant designed for electronic protection. It cures to a soft, transparent elastomer that offers excellent flow, long working time, and reliable protection for assemblies. The material requires no post-cure, cures without exotherm, and provides rapid curing at moderate temperatures, supporting energy savings and efficient throughput. Its low viscosity ensures penetration into narrow gaps and around complex geometries, while repairability offers rework flexibility.

2. Applications

  • Encapsulation of electrical and PCB system assemblies

  • Protective coating for sensitive electronic components

  • Potting in confined or complex geometries requiring stress relief

  • Reworkable encapsulation where repairs or modifications are needed

3. Typical Properties
DOWSIL™ SE 1740 Encapsulant delivers balanced processing and performance features. With a 1:1 mix ratio and long pot life, it enables flexible handling and reduced downtime. Its transparency, softness, and flowability make it ideal for delicate electronic assemblies, while dielectric properties ensure insulation reliability. Operating stability extends from -45 to 200°C, with short-term tolerance to -55°C and higher ranges depending on design. The material resists cure inhibition with proper substrate selection and provides ease of removal for repairs. Storage stability of 12 months at room temperature ensures dependable supply.

Property Unit Part A Part B Mixed / Cured
Viscosity cP / mPa·s / Pa·s 925 / 925 / 0.9 950 / 950 / 1.0 925 / 925 / 0.9
Refractive Index 1.4
Working Time (25°C) hr > 24
Heat Cure Time (80°C) min 30
Specific Gravity (Cured) 1.0
Durometer Shore 00 35
Unprimed Adhesion (Glass, Lap Shear) psi / MPa / N/cm² 30 / 0.2 / 20
Dielectric Strength volts/mil / kV/mm 425 / 17
Dielectric Constant (1 MHz) 2.83
Volume Resistivity ohm·cm 1.14 × 10¹⁵
Dissipation Factor (1 MHz) 0.000013
Shelf Life at 25°C months 12

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