Applications

DOWSIL™ SE 4422 Thermally Conductive Adhesive

  • Technology: Thermally Conductive Silicone Adhesive
  • Brand Name: DOWSIL™ SE 4422 Thermally Conductive Adhesive
  • Manufacturer: Dow Chemical Company
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

DOWSIL™ SE 4422 is a one-part, gray, moisture-cure, thermally conductive silicone adhesive. It is designed to provide efficient heat transfer for cooling electronic modules and appliances. This semi-flowable adhesive features fast tack-free time, good adhesion, and high thermal conductivity.

2. Applications

  • Thermal management for electronic modules
  • Cooling solutions for home appliance devices
  • Adhesive for bonding heat-generating components to heat sinks
  • Suitable for PCB system assemblies

3. Typical Properties

Before Curing (Uncured State)

Property Unit Value
One-part or two-part One-part
Color Gray
Fluidity mm (in) 42 (1.7)
NVC (Non-volatile content) % 99.4
Tack-free time (25°C) min 11

After Curing (Cured State)

Property Unit Value
Specific gravity 2.2
Tensile strength psi (MPa) 740 (5.1)
Elongation % 130
Durometer hardness Shore A 68
Lap shear adhesion (Al) psi (MPa) 206 (1.42)
Thermal conductivity W/m·K 0.9
Operating temperature range °C -45 to 200

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