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Thermal Management

DOWSIL™ SE 4422 – Two-component silicone adhesive – High-performance bonding and thermal management in electronic and industrial applications

  • Technology: Thermally Conductive Silicone Adhesive
  • Brand Name: DOWSIL™ SE 4422 Thermally Conductive Adhesive
  • Manufacturer: Dow Chemical Company
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

DOWSIL™ SE 4422 is a one-part, gray, moisture-cure, thermally conductive silicone adhesive. It is designed to provide efficient heat transfer for cooling electronic modules and appliances. This semi-flowable adhesive features fast tack-free time, good adhesion, and high thermal conductivity.

2. Applications

  • Thermal management for electronic modules
  • Cooling solutions for home appliance devices
  • Adhesive for bonding heat-generating components to heat sinks
  • Suitable for PCB system assemblies

3. Typical Properties

Before Curing (Uncured State)

Property Unit Value
One-part or two-part One-part
Color Gray
Fluidity mm (in) 42 (1.7)
NVC (Non-volatile content) % 99.4
Tack-free time (25°C) min 11

After Curing (Cured State)

Property Unit Value
Specific gravity 2.2
Tensile strength psi (MPa) 740 (5.1)
Elongation % 130
Durometer hardness Shore A 68
Lap shear adhesion (Al) psi (MPa) 206 (1.42)
Thermal conductivity W/m·K 0.9
Operating temperature range °C -45 to 200

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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