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Thermal Management

DOWSIL™ SE-4450 – Thermally Conductive Adhesive – Bonding and heat management for electronic components

  • Brand Name: DOWSIL™ SE 4450 Thermally Conductive Adhesive

  • Package Size: Available in 1 kg containers.

  • Shelf Life: 6 months from the date of manufacture.

DOWSIL™ SE 4450 Thermally Conductive Adhesive is a one-part, gray, flowable silicone adhesive designed for efficient thermal management in electronic applications. It offers high tensile strength and excellent adhesion, making it suitable for bonding and sealing components where heat dissipation is crucial.

Applications:

  • Thermal interface material (TIM) for chip packaging
  • Bonding integrated circuits (ICs) to heat sinks
  • Sealing and bonding in power supply components
  • General electronic module assembly

DOWSIL™ SE 4450 Thermally Conductive Adhesive

Typical Properties:

Property Unit Value
Color Gray
Viscosity mPa·s 66,000
Heat Cure Time at 150°C minutes 30
Specific Gravity (Cured) 2.73
Durometer Hardness Shore A 95
Tensile Strength MPa 6.7
Elongation % 46
Unprimed Adhesion – Lap Shear (Aluminum) MPa 3.45
Dielectric Strength kV/mm 22
Thermal Conductivity W/m·K 1.92

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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