DOWSIL™ SE 4485 is a one-part, white, moisture-curing silicone adhesive designed for thermal management applications. It provides high thermal conductivity, good adhesion, and fast tack-free time, making it suitable for cooling electronic modules.
Key Features & Benefits:
Composition:
DOWSIL™ SE 4485 is designed for efficient thermal transfer in various electronic cooling applications, including:
It is particularly effective in managing heat from components by creating a thermal bridge between the device and heat dissipation elements like heat sinks.
| Property | Unit | Result |
|---|---|---|
| Before Curing (Unmixed) | ||
| One-part or Two-part | – | One-part |
| Color | – | White |
| Fluidity | mm (inches) | 54 (2.1) |
| Non-Volatile Content (NVC) | % | 99.2 |
| After Curing | ||
| Specific Gravity | – | 2.9 |
| Tack-Free Time @ 25°C | minutes | 10 |
| Tensile Strength | psi (MPa) | 492 (3.4) |
| Hardness (Shore A) | – | 90 |
| Lap Shear Strength (Glass) | psi (MPa) | 168 (1.2) |
| Dielectric Strength | kV/mm | 19 |
| Thermal Conductivity | W/mK | 2.8 |
| Agency Rating | – | UL 94 V-0 |
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