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Thermal Management

DOWSIL™ SE 4486 Thermally Conductive Adhesive – Two-component silicone adhesive – Heat dissipation and bonding in electronics assemblies

  • Technology: Thermally Conductive Silicone Adhesive
  • Brand Name: DOWSIL™ SE 4486 Thermally Conductive Adhesive
  • Manufacturer: Dow
  • Package Size: Contact Techniq VN for details
  • Shelf Life: Contact Techniq VN for details

1. Product Overview

  • Type: One-part, moisture-cure, thermally conductive silicone adhesive
  • Key Features & Benefits:
    • Semi-flowable
    • Fast tack-free time
    • Good adhesion to various substrates
    • High thermal conductivity (1.6 W/mK)
    • Durable elastomer with non-corrosive by-products
  • Composition:
    • Polydimethylsiloxane adhesive
    • Thermally conductive filler

2. Applications

  • Designed for efficient thermal transfer in cooling modules of various home appliance devices.
  • Used in PCB system assemblies to manage heat in compact electronic designs.
  • Acts as a thermal bridge to transfer heat from heat sources to a heat sink.

3. Typical Properties

Property Unit Value
Before Curing (Uncured State)
Color White
Viscosity cP / Pa·s / mPa·s 19,600 (19.6 Pa·s)
Fluidity mm / in 60 (2.32)
Tack-Free Time at 25°C minutes 4
After Curing
Specific Gravity (Cured) 2.6
Tensile Strength psi / mPa / kg/cm² 570 / 3.9 / 40
Elongation % 43
Hardness Shore A (JIS) 81
Lap Shear Adhesion (Glass to Glass) psi / mPa / N/cm² 240 / 1.65 / 165
Thermal Conductivity W/mK / btu/hr-ft-°F 1.6 / 0.92
Usable Temperature Range °C / °F -45 to 200 (-49 to 392)

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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