Applications

DOWSIL™ SE 4486 Thermally Conductive Adhesive

  • Technology: Thermally Conductive Silicone Adhesive
  • Brand Name: DOWSIL™ SE 4486 Thermally Conductive Adhesive
  • Manufacturer: Dow
  • Package Size: Contact Techniq VN for details
  • Shelf Life: Contact Techniq VN for details

1. Product Overview

  • Type: One-part, moisture-cure, thermally conductive silicone adhesive
  • Key Features & Benefits:
    • Semi-flowable
    • Fast tack-free time
    • Good adhesion to various substrates
    • High thermal conductivity (1.6 W/mK)
    • Durable elastomer with non-corrosive by-products
  • Composition:
    • Polydimethylsiloxane adhesive
    • Thermally conductive filler

2. Applications

  • Designed for efficient thermal transfer in cooling modules of various home appliance devices.
  • Used in PCB system assemblies to manage heat in compact electronic designs.
  • Acts as a thermal bridge to transfer heat from heat sources to a heat sink.

3. Typical Properties

Property Unit Value
Before Curing (Uncured State)
Color White
Viscosity cP / Pa·s / mPa·s 19,600 (19.6 Pa·s)
Fluidity mm / in 60 (2.32)
Tack-Free Time at 25°C minutes 4
After Curing
Specific Gravity (Cured) 2.6
Tensile Strength psi / mPa / kg/cm² 570 / 3.9 / 40
Elongation % 43
Hardness Shore A (JIS) 81
Lap Shear Adhesion (Glass to Glass) psi / mPa / N/cm² 240 / 1.65 / 165
Thermal Conductivity W/mK / btu/hr-ft-°F 1.6 / 0.92
Usable Temperature Range °C / °F -45 to 200 (-49 to 392)

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