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Thermal Management

DOWSIL™ SE 9152 HT – Adhesive – High-Temperature Electronics & Sealing

  • Item Name: DOWSIL™ SE 9152 HT Adhesive
  • Manufacturer: Dow Chemical Company
  • Technologies: Polydimethylsiloxane-based, one-part moisture cure adhesive
  • Color: Reddish brown
  • Cure Type: Room temperature (RT) cure with optional heat acceleration
  • Package Size: Contact to Techniq VN for details.
  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

DOWSIL™ SE 9152 HT Adhesive is a highly flowable, fast tack-free, one-part polydimethylsiloxane adhesive with excellent thermal stability. It offers rapid room-temperature (RT) cure, no mixing, and enhanced heat resistance for sustained exposure up to 275°C.

2. Applications

  • Sealing of sheathed heater terminations
  • Staking, fixing, and sealing of high-temperature components
  • Automated or manual dispensing applications

3. Typical Properties

Property Unit Result
Viscosity cP 10,700
Specific Gravity 1.05
Non-Volatile Content % 98.3
Skin Over Time (25°C) Minutes 22
Tensile Strength psi (MPa) 270 (1.9)
Elongation % 280
Tensile Modulus psi (MPa) 100 (0.7)
Durometer (Shore A) 29
Dielectric Strength kV/mm 25
Volume Resistivity ohm·cm 3.0E16
Dielectric Constant (1 MHz) 2.6
Dissipation Factor (1 MHz) 0.001

4. Key Features & Benefits

Fast RT cure – No ovens required
Low viscosity – Good flow and self-leveling
Heat resistance – Sustained exposure up to 275°C
Strong adhesion – Works on metals, ceramics, glass, and some plastics
Electrical insulation – Stable dielectric properties

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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