DOWSIL™ SE 9186 L Sealant is a one-part, translucent, fast tack-free, flowable silicone conformal coating/adhesive with controlled volatility. It cures at room temperature into a soft, low-stress elastomer and does not contain added solvents.
| Property | Unit | Value |
|---|---|---|
| Type | – | One-part |
| Color | – | Translucent |
| Viscosity | cP / Pa-sec | 27,000 / 27 |
| Specific Gravity (Cured) | – | 1.02 |
| Low Molecular Weight Siloxanes (D4-D10) | ppm | 23 |
| Low Molecular Weight Siloxanes (D4-D20) | ppm | 169 |
| Tack-Free Time (25°C) | minutes | 8 |
| Cure Time (20°C, 55% RH, 1 mm) | hours | 5 |
| Durometer | Shore A | 25 |
| Tensile Strength | MPa | 1.6 |
| Elongation | % | 340 |
| Adhesive Strength (Glass) | N/cm² | 92 |
| Dielectric Strength | Volts/mil / kV/mm | 575 / 23 |
| Volume Resistivity | Ohm.cm | 6.0E+15 |
| Dielectric Constant (1 MHz) | – | 2.7 |
| Dissipation Factor (1 MHz) | – | 0.001 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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