Item Name: DOWSIL™ SE 9189 L White
Manufacturer: The Dow Chemical Company
Technologies: One-part, room-temperature curing polydimethylsiloxane silicone adhesive
Color: White
Cure Type: Room-temperature moisture cure, fast tack-free
Package Size: Contact to Techniq VN for details
Shelf Life: Contact to Techniq VN for details
DOWSIL™ SE 9189 L White is a one-part, fast tack-free, flowable silicone adhesive that cures at room temperature without the need for ovens. It forms a soft, low-stress elastomer with controlled volatility, no added solvents, and offers flame resistance (UL 94 V-0). The adhesive can be handled quickly after application, and mild heat can accelerate curing. It maintains its physical and electrical properties over a wide range of conditions, enhancing the reliability and service life of electronic devices.
Fixing parts on circuit boards
Vibration dampening
Sealing applications
Application Methods: Automated or manual needle flow
Surface Preparation: Clean/degrease surfaces, light abrasion recommended, final wipe with acetone or IPA
Substrate Adhesion: Effective on reactive metals, ceramics, glass, and select laminates/resins; special treatment may be needed for non-reactive plastics or highly plasticized substrates
Temperature Range: Operational from -45 to 150°C long-term; short-term up to 250°C
Solvent Exposure: Splash or intermittent only, not suitable for continuous exposure
Before Mixing (One-part)
| Test Property | Unit | Result |
|---|---|---|
| One-part or two-part | — | One |
| Color | — | White |
| Viscosity | cP / Pa·s | 22000 / 22 |
| Specific gravity (cured) | — | 1.19 |
| Tack-free time at 25°C | minutes | 8 |
| Lap shear adhesion (glass) | N/cm² | 120 |
After Curing
| Test Property | Unit | Result |
|---|---|---|
| Tensile strength | psi / MPa / kg/cm² | 284 / 2.0 / 20 |
| Elongation | % | 220 |
| Durometer | Shore A | 33 |
| Low molecular weight D4-D10 | ppm | 20 |
| Low molecular weight D4-D20 | ppm | 110 |
| Dielectric strength | volts/mil / kV/mm | 625 / 25 |
| Volume resistivity | ohm·cm | 9.0E+14 |
| Dielectric constant at 1 MHz | — | 3.1 |
| Dissipation factor at 1 MHz | — | 0.0004 |
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