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DOWSIL™ SE 9189 L White for parts fixing, vibration dampening, and sealing in electronic assemblies

  • Item Name: DOWSIL™ SE 9189 L White

  • Manufacturer: The Dow Chemical Company

  • Technologies: One-part, room-temperature curing polydimethylsiloxane silicone adhesive

  • Color: White

  • Cure Type: Room-temperature moisture cure, fast tack-free

  • Package Size: Contact to Techniq VN for details

  • Shelf Life: Contact to Techniq VN for details

1. Product Overview

DOWSIL™ SE 9189 L White is a one-part, fast tack-free, flowable silicone adhesive that cures at room temperature without the need for ovens. It forms a soft, low-stress elastomer with controlled volatility, no added solvents, and offers flame resistance (UL 94 V-0). The adhesive can be handled quickly after application, and mild heat can accelerate curing. It maintains its physical and electrical properties over a wide range of conditions, enhancing the reliability and service life of electronic devices.


2. Applications

  • Fixing parts on circuit boards

  • Vibration dampening

  • Sealing applications

Application Methods: Automated or manual needle flow
Surface Preparation: Clean/degrease surfaces, light abrasion recommended, final wipe with acetone or IPA
Substrate Adhesion: Effective on reactive metals, ceramics, glass, and select laminates/resins; special treatment may be needed for non-reactive plastics or highly plasticized substrates
Temperature Range: Operational from -45 to 150°C long-term; short-term up to 250°C
Solvent Exposure: Splash or intermittent only, not suitable for continuous exposure

3. Typical Properties

Before Mixing (One-part)

Test Property Unit Result
One-part or two-part One
Color White
Viscosity cP / Pa·s 22000 / 22
Specific gravity (cured) 1.19
Tack-free time at 25°C minutes 8
Lap shear adhesion (glass) N/cm² 120

After Curing

Test Property Unit Result
Tensile strength psi / MPa / kg/cm² 284 / 2.0 / 20
Elongation % 220
Durometer Shore A 33
Low molecular weight D4-D10 ppm 20
Low molecular weight D4-D20 ppm 110
Dielectric strength volts/mil / kV/mm 625 / 25
Volume resistivity ohm·cm 9.0E+14
Dielectric constant at 1 MHz 3.1
Dissipation factor at 1 MHz 0.0004

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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