Item Name: DOWSIL™ SE 9189 L White
Manufacturer: The Dow Chemical Company
Technologies: One-part, room-temperature curing polydimethylsiloxane silicone adhesive
Color: White
Cure Type: Room-temperature moisture cure, fast tack-free
Package Size: Contact to Techniq VN for details
Shelf Life: Contact to Techniq VN for details
DOWSIL™ SE 9189 L White is a one-part, fast tack-free, flowable silicone adhesive that cures at room temperature without the need for ovens. It forms a soft, low-stress elastomer with controlled volatility, no added solvents, and offers flame resistance (UL 94 V-0). The adhesive can be handled quickly after application, and mild heat can accelerate curing. It maintains its physical and electrical properties over a wide range of conditions, enhancing the reliability and service life of electronic devices.
Fixing parts on circuit boards
Vibration dampening
Sealing applications
Application Methods: Automated or manual needle flow
Surface Preparation: Clean/degrease surfaces, light abrasion recommended, final wipe with acetone or IPA
Substrate Adhesion: Effective on reactive metals, ceramics, glass, and select laminates/resins; special treatment may be needed for non-reactive plastics or highly plasticized substrates
Temperature Range: Operational from -45 to 150°C long-term; short-term up to 250°C
Solvent Exposure: Splash or intermittent only, not suitable for continuous exposure
Before Mixing (One-part)
| Test Property | Unit | Result |
|---|---|---|
| One-part or two-part | — | One |
| Color | — | White |
| Viscosity | cP / Pa·s | 22000 / 22 |
| Specific gravity (cured) | — | 1.19 |
| Tack-free time at 25°C | minutes | 8 |
| Lap shear adhesion (glass) | N/cm² | 120 |
After Curing
| Test Property | Unit | Result |
|---|---|---|
| Tensile strength | psi / MPa / kg/cm² | 284 / 2.0 / 20 |
| Elongation | % | 220 |
| Durometer | Shore A | 33 |
| Low molecular weight D4-D10 | ppm | 20 |
| Low molecular weight D4-D20 | ppm | 110 |
| Dielectric strength | volts/mil / kV/mm | 625 / 25 |
| Volume resistivity | ohm·cm | 9.0E+14 |
| Dielectric constant at 1 MHz | — | 3.1 |
| Dissipation factor at 1 MHz | — | 0.0004 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.