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DOWSIL™ TC-3015 – One-part re-workable thermal gel for smartphone CPU, memory, and PCB assembly thermal management

  • Item Name: DOWSIL™ TC-3015 Re-workable Thermal Gel

  • Manufacturer: The Dow Chemical Company

  • Technologies: One-part heat-cure silicone-based re-workable thermal gel

  • Color: Light pink

  • Cure Type: Room temperature or accelerated heat cure at 60–100°C

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 12 months

1. Product Overview

DOWSIL™ TC-3015 is a one-part, re-workable silicone-based thermal gel. It can cure at room temperature or be accelerated at 60–100°C to form a soft, elastic gel suitable for thermal transfer, stress relief, and shock damping. The gel is designed for easy rework, allowing peeled-off removal without residue. It resists humidity and harsh environments while maintaining low volatile content, making it ideal for high-performance PCB system assemblies.


2. Applications

  • Thermal interface material for smartphone CPUs and memory chips

  • General thermal management of PCB system assemblies

  • Printable or dispensable gel to replace fabricated thermal pads

Application Methods: Auto/manual dispensing or screenprinting.

3. Typical Properties

Property Unit Result
Color Light pink
Viscosity (1 rpm) mPa·s 220,000
Extrusion Rate g/min 320
Specific Gravity (Cured) 2.6
Curing Time at 60°C hrs 8
Curing Time at 100°C mins 60
Durometer Shore 00 72
Tensile Strength MPa 0.3
Elongation % 72
Dielectric Strength kV/mm 14.7
Volume Resistivity ohm·cm 5.9 × 10¹⁴
Thermal Conductivity W/m·K 2.0
Shelf Life months 12 (at -25°C to -10°C)

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