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Thermal Management

DOWSIL™ TC-3035 Reworkable Thermal Gel – Silicone thermal gel – Heat dissipation and reworkable thermal management in electronics

  • Brand Name: DOWSIL™ TC-3035 Reworkable Thermal Gel

  • Available Sizes: 6 oz (150 mL) syringe packaging & 520 g CRT.

  • Shelf Life: 9 months after the manufacturing date when stored at -5°C to -20°C

Product Overview

DOWSIL™ TC-3035 Reworkable Thermal Gel is a one-part, pink, thermally conductive silicone gel designed to dissipate heat in electronic applications. It offers a thermal conductivity of 4.0 W/m·K and cures at room temperature or can be accelerated with heat. The gel cures to a soft, reworkable material that provides effective thermal transfer, stress relief, and shock damping. It is suitable for dispensing or screen printing to various thicknesses and shapes, ensuring versatility in thermal management solutions.

Applications

DOWSIL™ TC-3035 Reworkable Thermal Gel is suitable for applications including:

  • Thermal interface material for smartphone application processors
  • Baseband processors or System on Chips (SoCs)
  • Heat dissipation for power modules or other power devices

Typical Properties

Property Unit Value
Color Pink
Viscosity (10 s⁻¹) Pa·s 260
Specific Gravity (Cured) g/cm³ 3.2
Thermal Conductivity W/m·K 4.0
Extrusion Rate g/min 75
Durometer Shore 00 75
Tensile Strength psi 40
Elongation % 30
Pot Life at 25°C days 7
Dielectric Strength kV/mm 13.2
Volume Resistivity ohm·cm 1.7 × 10¹⁴
Curing Time at 80°C minutes 30
Minimum Bond Line Thickness (BLT) microns 60
Shelf Life from Date of Manufacture at -10°C months 12

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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