• Item Name: DOWSIL™ TC-3065 Thermal Gel
• Manufacturer: Dow Chemical Company
• Technologies: Silicone-based, thermally conductive, reworkable gel
• Color: Gray
• Cure Type: Room temperature or accelerated heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
DOWSIL™ TC-3065 is a one-part, gray, thermally conductive silicone gel designed for heat dissipation in electronic assemblies. It offers thermal conductivity of 6.5 W/mK, good adhesion, and re-workability, enabling complete removal without residue. The gel cures at room temperature or faster at elevated temperatures, forming a stable, elastic pad resistant to humidity, mechanical stress, and harsh environments. With low volatile content and ease of automated dispensing, it is suitable for high-reliability thermal management in compact devices.
Optical transceivers thermal interface
PCB system assemblies
Replacement for fabricated thermal pads
General heat dissipation for power devices and sensitive electronics
| Property | Condition | Value |
|---|---|---|
| Part Type | – | One-part |
| Color | – | Gray |
| Viscosity | 25°C, @10 s⁻¹ | 200 Pa·s |
| Extrusion Rate | – | 60 g/min |
| Cure Time | 100°C | 30 min |
| Hardness | Shore 00 | 60 |
| Tensile Strength | – | 0.2 MPa |
| Elongation | – | 20% |
| Specific Gravity (Cured) | – | 3.45 g/cm³ |
| Working Time | 25°C | 5 days |
| Dielectric Strength | – | 10 kV/mm |
| Volume Resistivity | – | 7 × 10¹³ Ω·cm |
| Thermal Conductivity | Hot Disk | 6.5 W/mK |
| Bond Line Thickness | – | 150 μm |
| NVC | – | 99.9% |
| Shelf Life | -10°C | 12 months |
| Operating Temp. Range | – | -45 to 150°C |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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