• Item Name: DOWSIL™ TC-3080 Curable Thermal Gel
• Manufacturer: Dow Chemical Company
• Technologies: Silicone-based, thermally conductive curable gel
• Color: Blue
• Cure Type: Room temperature or accelerated heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
DOWSIL™ TC-3080 is a one-part, curable thermal gel engineered for ultra-soft heat management applications. It combines high thermal conductivity (7.0 W/mK) with very low bond line thickness (BLT), enabling excellent heat dissipation in compact electronics. The material cures at room temperature or faster under heat, forming a soft, stress-relieving, shock-damping elastomer. With strong environmental resistance and long working time, it provides reliable thermal interface performance in high-demand electronics.
Smart devices and consumer electronics
Arrayed power chips and optical interconnects
5G communication and autonomous vehicles
High-performance computers and servers
Telecommunications systems
| Property | Condition | Value |
|---|---|---|
| Part Type | – | One-part |
| Color | – | Blue |
| Specific Gravity (Cured) | – | 3.4 g/ml |
| Viscosity | 25°C, @10s⁻¹ | 200 Pa·s |
| Thermal Conductivity | – | 7.0 W/mK |
| Hardness | Shore OOO | 60 |
| Extrusion Rate | 90 psi, 30cc EFD | 60 g/min |
| Bond Line Thickness | 40 psi | 40 μm |
| Cure Time | 80°C | 30 min |
| Dielectric Strength | 1 mm | 11 kV/mm |
| Volume Resistivity | – | 1.0 × 10¹⁴ Ω·cm |
| Operating Temp. Range | – | -45 to 200°C |
| Storage Condition | – | < 10°C |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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