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Thermal Management

DOWSIL™ TC-4551 CV Thermally Conductive Gap Filler provides superior heat dissipation for automotive electronic modules.

  • Item Name: DOWSIL™ TC-4551 CV Thermally Conductive Gap Filler

  • Manufacturer: Dow

  • Technologies: Two-part silicone, thermally conductive, addition-cure

  • Color: Part A – White, Part B – Blue

  • Cure Type: Room temperature or heat accelerated cure

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 6 months

1. Product Overview

DOWSIL™ TC-4551 CV is a two-part silicone-based thermally conductive gap filler with a thermal conductivity of 5.2 W/m·K. It cures at room temperature or with heat acceleration to form a soft, compressible elastomer that ensures reliable heat dissipation. The formulation provides long-term stability under thermal cycling up to 150°C, low volatility, and strong dielectric insulation. It maintains vertical position after curing, requires no post-cure, and is suitable for confined geometries without exothermal reaction. Designed for robust cooling in automotive and high-reliability electronics, it combines thermal management with vibration and stress relief.


2. Applications

  • Cooling solution for PCB-mounted automotive control units (engine, transmission modules)

  • Heat transfer from electronic modules to heat sinks or housings

  • Thermal interface in environments with high cycling stress and extended operating life

  • Situations demanding compressible, low-resistance gap fillers for stable long-term performance

3. Typical Properties

Property Condition Value
Part Type Two-part (A+B, 1:1 mix)
Color Part A: White; Part B: Blue; Mixed: Blue
Viscosity Part A / B 290 Pa·s each
Viscosity (Mixed) 10 s⁻¹ 250 Pa·s
Thixotropic Index Mixed 3.0
Working Time 25°C 60 min
Cure Time 25°C / 80°C 120 / 15 min
Density (Cured) 3.3 g/cm³
Hardness Shore 00 / JIS E 54 / 25
Thermal Conductivity Various methods 5.0–5.2 W/m·K
Thermal Resistivity BLT 115 µm / 500 µm / 1500 µm 0.3 / 1.2 / 3.1 °C/W
Bond Line Thickness 0.66 MPa 61 µm
Heat Capacity -40 / 25 / 150°C 0.72 / 0.84 / 1.06 J/g·°C
Volatile Siloxane (D4–D10) 13 ppm
Dielectric Strength 20 kV/mm
Volume Resistivity 2 × 10¹² Ω·cm
Dielectric Constant / Dissipation Factor 1 MHz 6.9 / 0.005
Flammability UL 94 V-0 (0.15 & 3.0 mm)
Shelf Life 40°C 6 months
Operating Temp. Range -45 to 150°C

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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