DOWSIL™ TC-5021 is a gray, flowable, non-curing thermally conductive compound designed for efficient heat transfer in electronic components. It is heavily filled with heat-conductive metal oxides, ensuring high thermal conductivity, low bleed, and high-temperature stability. The compound creates a positive heat sink seal, improving thermal dissipation and overall device efficiency.
DOWSIL™ TC-5021 is used for:
| Property | Unit | Result |
|---|---|---|
| Type | – | One-part |
| Color | – | Gray |
| Viscosity | cP / mPa·s / Pa·s | 82,650 / 82,650 / 82.6 |
| Specific Gravity (Uncured) | – | 3.47 |
| Bleed | % | 0.15 |
| Non-Volatile Content (NVC) | % | 99.8 |
| Thermal Conductivity | W/m·K | 3.3 |
| Thermal Resistance (40 psi) | °C-cm²/W | 0.2 |
| Dielectric Strength | volts/mil / kV/mm | 125 / 5 |
| Dissipation Factor (1 kHz) | – | 0.06 |
| Dielectric Constant (1 kHz) | – | 8.1 |
| Volume Resistivity | ohm·cm | 3.7 × 10¹¹ |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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