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Thermal Management

DOWSIL™ TC-5021 – Two-component thermally conductive silicone – Heat transfer and electrical insulation in electronics assemblies

  • Technology: Thermally Conductive Compound
  • Brand Name: DOWSIL™ TC-5021 Thermally Conductive Compound
  • Manufacturer: Dow
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

 

 

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1. Product Overview

DOWSIL™ TC-5021 is a gray, flowable, non-curing thermally conductive compound designed for efficient heat transfer in electronic components. It is heavily filled with heat-conductive metal oxides, ensuring high thermal conductivity, low bleed, and high-temperature stability. The compound creates a positive heat sink seal, improving thermal dissipation and overall device efficiency.

2. Applications

DOWSIL™ TC-5021 is used for:

  • Thermal management of MPU (Microprocessor Units) in servers, desktops, and notebooks
  • Providing heat dissipation in PCB system assemblies
  • Achieving thin Bond Line Thickness (BLT) for optimized thermal transfer

3. Typical Properties

Property Unit Result
Type One-part
Color Gray
Viscosity cP / mPa·s / Pa·s 82,650 / 82,650 / 82.6
Specific Gravity (Uncured) 3.47
Bleed % 0.15
Non-Volatile Content (NVC) % 99.8
Thermal Conductivity W/m·K 3.3
Thermal Resistance (40 psi) °C-cm²/W 0.2
Dielectric Strength volts/mil / kV/mm 125 / 5
Dissipation Factor (1 kHz) 0.06
Dielectric Constant (1 kHz) 8.1
Volume Resistivity ohm·cm 3.7 × 10¹¹

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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